Backplane LED Integration with Sidewall Passivation
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Solution Overview
Problem
Current display technologies face challenges in efficiently integrating and functionalizing LEDs on a display backplane, particularly in achieving uniform light emission and reducing power consumption, especially with the integration of inorganic semiconductor-based micro LEDs.
Innovation Solution
The integration and functionalization of inorganic semiconductor-based micro LEDs on a display backplane involve forming insulating bank layers, conductive terminal structures, and top electrode layers to create well structures for sidewall passivation and electrical connection, allowing for uniform signal distribution and reduced contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If insulating bank layers and conductive terminal structures are formed to create well structures for sidewall passivation, then uniform light emission is achieved, but device complexity increases
Solution Approach 1:
The display backplane is divided into discrete pixel regions, each containing segmented components (insulating bank layer, conductive terminal structures, sidewall passivation layers) that are independently formed and positioned. This segmentation allows uniform light emission from each pixel while maintaining overall device functionality through modular construction.
Solution Approach 2:
Different regions of the display backplane are assigned different functional properties: insulating bank layers provide electrical isolation in specific areas, conductive terminal structures provide electrical connection in other areas, and sidewall passivation layers provide protection where needed. This local differentiation of material properties achieves uniform light emission while managing device complexity through functional zoning.
2Reliability
If conductive terminal structures and top electrode layers are formed to optimize electrical connections, then contact resistance is reduced, but manufacturing complexity increases
Solution Approach 1:
Conductive terminal structures and top electrode layers are formed in advance during the manufacturing process, before final assembly. This preliminary formation of electrical connection structures ensures low contact resistance is achieved inherently through proper material selection and structural design, rather than requiring post-assembly adjustments or complex connection protocols.
Solution Approach 2:
Multiple functional layers (conductive terminal structures, top electrode layers, insulating bank layers) are merged into an integrated structure where electrical connection and insulation functions are combined in a single manufactured assembly. This merging reduces the number of separate manufacturing steps and components, thereby reducing overall manufacturing complexity while maintaining low contact resistance.
3Reliability
If sidewall passivation layers are formed around LEDs, then device reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
Sidewall passivation layers are formed as intermediary structures between the LED active regions and the surrounding environment. These passivation layers act as mediator elements that protect the LEDs from moisture and electrical interference, improving device reliability. The passivation structures are designed with sufficient dimensional tolerance to accommodate normal manufacturing variations while still providing effective protection.
Solution Approach 2:
The manufacturing process parameters for forming sidewall passivation layers are optimized to achieve the required protection level without demanding extreme precision. Material selection, layer thickness, and formation conditions are adjusted within acceptable ranges to provide reliable passivation while accommodating standard manufacturing capabilities, thereby balancing reliability improvement with manufacturing feasibility.
Data Source
AI summary
Display integration schemes are described for passivating LEDs and providing conductive terminal connections. In accordance with embodiments, a sidewall passivation layer is formed around the LEDs. The sidewall passivation layer may or may not be contained within a well structure. A top electrode layer is formed to electrically connect the LEDs to conductive terminal routing.