Backplane Unit Light-Shielding Layer Patterning
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Solution Overview
Problem
The conventional manufacturing process of mini-LED backplanes results in corrosion of the exposed metal pad by the developer, leading to residual organic black organic layer formation, which affects the performance and welding of light-emitting elements.
Innovation Solution
A method involving forming a photoresist layer on an array substrate, exposing it, and creating a light-shielding layer with a protective reflective layer, followed by lateral stripping using a non-corrosive solution to prevent metal corrosion and pattern the light-shielding layer after the light-emitting element is disposed, ensuring the light-shielding layer does not cover redundant spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional developer is used to pattern the black organic layer, then the black organic layer can be removed, but the exposed metal pad is corroded and metal diffuses into the organic layer forming a development barrier
Solution Approach 1:
The patent introduces a photoresist layer as an intermediary between the metal pad and the black organic layer. This photoresist layer is patterned first to define the metal pad areas, then the black organic layer is formed and patterned using a separate development process. The photoresist acts as a protective intermediary that prevents the developer from contacting and corroding the metal pad during the black organic layer patterning process.
Solution Approach 2:
The patent performs preliminary patterning of the metal pad area using a photoresist layer before forming and patterning the black organic layer. By pre-defining the metal pad boundaries with photoresist and performing preliminary cleaning and patterning steps, the subsequent development process can remove the black organic layer without exposing the metal pad to corrosive developers.
2Ease of manufacture
If the light-shielding layer is formed before the light-emitting element is disposed, then the manufacturing process is simplified, but the light-shielding layer may cover redundant spaces and cause light leakage
Solution Approach 1:
The patent performs preliminary actions of forming the photoresist layer, patterning the metal pad area, and cleaning the surface before disposing the light-emitting element. This preliminary preparation ensures that when the light-shielding layer is subsequently formed, it can be precisely patterned to match the actual light-emitting element positions, avoiding coverage of redundant spaces while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method avoids metal corrosion and light leakage by patterning the light-shielding layer correctly, enhancing the welding of light-emitting elements and preventing oxidation, thus improving the performance and efficiency of the backplane unit.
Implementation Method 1
performing exposure on at least a portion of the photoresist layer corresponding to the light-emitting element
Implementation Method 2
laterally stripping the photoresist layer on the light-emitting element with a stripping solution
Data Source
AI summary
The present application provides a backplane unit, a manufacturing method thereof, and a display device. The manufacturing method includes the following steps: forming a photoresist layer on an array substrate; performing exposure on at least a portion of the photoresist layer corresponding to a light-emitting element; forming a light-shielding layer on at least a side of the photoresist layer away from the array substrate, wherein the light-shielding layer exposes at least a side portion of the light-emitting element; and laterally stripping the photoresist layer on the light-emitting element with a stripping solution to obtain the backplane unit.