Backplate Manufacturing Method for Light Emitting Devices
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Solution Overview
Problem
The existing backplate manufacturing methods for light emitting devices face issues with metal layer erosion and oxidation during the formation of the light shielding layer, leading to residue formation and reduced soldering effectiveness, which lowers the yield rate of the backplate.
Innovation Solution
A backplate manufacturing method involving the formation of a second passivation layer on the anode and cathode before patterning the light shielding layer, preventing developer corrosion and metal spreading, and subsequent removal of the passivation layer to expose the bonding regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the light shielding layer is manufactured by washing, adhesive coating, exposing, and developing processes with exposed metal layer, then the light shielding layer can be formed, but the developer corrodes the metal layer and metal spreads to form a development barrier layer resulting in residue
Solution Approach 1:
A passivation layer is introduced as an intermediary between the metal layer and the developer during the light shielding layer formation process. This passivation layer prevents direct contact between the developer and metal layer, eliminating corrosion and metal spreading while allowing the light shielding layer to be properly formed through standard photolithography processes.
Solution Approach 2:
The metal layer is pre-treated with a passivation layer before the light shielding layer formation process begins. This preliminary protective action prevents harmful interactions during subsequent washing, adhesive coating, exposing, and developing steps, ensuring clean metal surfaces for optimal soldering.
2Reliability
If the light shielding layer is baked, then the light shielding layer is cured, but the exposed metal layer is oxidized influencing soldering effect
Solution Approach 1:
The passivation layer serves as a protective intermediary during the baking process, allowing the light shielding layer to be properly cured while preventing oxygen from reaching and oxidizing the metal layer. This ensures both effective curing and metal layer integrity.
Solution Approach 2:
The passivation layer creates an inert protective environment around the metal layer during baking, isolating it from oxidative conditions while still permitting the necessary thermal energy to cure the light shielding layer adhesive.
3Ease of operation
If the metal layer is exposed to facilitate soldering, then soldering access is improved, but the metal layer is vulnerable to corrosion and oxidation
Solution Approach 1:
The metal layer is pre-protected with a passivation layer that is selectively removed only in the bonding region where soldering is required. This preliminary protective action maintains metal integrity throughout the manufacturing process while preserving soldering accessibility at the final stage.
Solution Approach 2:
The passivation layer is selectively removed in the bonding region to expose the metal layer only where needed for soldering, while maintaining protection over the rest of the metal layer. This local quality approach provides soldering access precisely where required without compromising overall metal layer protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the soldering effect and improves the yield rate of the backplate by preventing metal layer erosion and oxidation, ensuring better bonding and production efficiency.
Implementation Method 1
Because the second passivation layer is formed on the anode and the cathode in advance before patterning the light shielding layer, the developer is prevented from corroding the second metal layer and the metal is prevented from spreading to the light shielding layer
Implementation Method 2
patterning the first passivation layer to form an aperture region, wherein the aperture region is configured to expose out the anode and the cathode
Data Source
AI summary
The present invention provides a backplate manufacturing method including: manufacturing a second metal layer on an underlay substrate; patterning the second metal layer to form an anode and a cathode; forming a first passivation layer on the second metal layer, patterning the first passivation layer to form an aperture region, wherein the aperture region is configured to expose out the anode and the cathode; manufacturing a second passivation layer on the first passivation layer, the anode, and the cathode; manufacturing a light shielding layer on the second passivation layer, patterning the light shielding layer to remove a part of the light shielding layer in a position corresponding to the aperture region; and removing a part of the second passivation layer above the anode and the cathode. The method of the present invention can provide a soldering effect of the light emitting device and a yield rate of a backplate.