Backside Circuit Layout for Seamless Tiled Display Panels
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Solution Overview
Problem
The challenge of achieving seamless tiling of high-resolution display panels is increasing due to the reduced gap between tiled panels, which affects image display quality and panel reliability.
Innovation Solution
A display device design incorporating an auxiliary substrate with an auxiliary circuit, a display substrate with a circuit, and a circuit board connected via a conductive via, featuring a through hole and conductive structures to reduce the space occupied by circuits and wiring, thereby enhancing panel-tiling reliability and usability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the resolution of the display increases, then the image quality is improved, but the gap between the tiled panels is reduced making seamless tiling more difficult to achieve
Solution Approach 1:
The patent moves the signal driving terminal from the front surface to the backside of the display substrate through a side surface connection structure. This dimensional relocation allows the circuit board to connect to the display substrate from the side, enabling seamless tiling at the front surface while maintaining high resolution displays.
Solution Approach 2:
The patent divides the circuit connection into separate components: the display substrate, the auxiliary substrate, and the circuit board connected via side surface. This segmentation allows independent optimization of each component, enabling the display substrate to achieve high resolution while the connection structure handles the tiling alignment requirements.
2Ease of manufacture
If the original panel structure is used, then the manufacturing process is simple, but the difficulty of achieving seamless tiling increases with higher resolution
Solution Approach 1:
The patent relocates the signal driving terminal to the backside of the display substrate and establishes connection through the side surface. This dimensional reconfiguration separates the high-precision front display surface from the connection interface, allowing seamless tiling to be achieved without compromising manufacturing simplicity.
3Ease of operation
If circuits and wiring are placed on the front surface of the display substrate, then the electrical connection is direct, but the space occupied by circuits reduces the display area
Solution Approach 1:
The patent extracts the signal driving terminal and circuit board connection from the front surface of the display substrate and relocates them to the backside through side surface connection. This extraction eliminates the need for front surface circuits and wiring, maximizing the display area while maintaining efficient electrical connection through the auxiliary substrate and circuit board.
Solution Approach 2:
The patent relocates the electrical connection structure from the two-dimensional front surface to the three-dimensional space utilizing the side surface and backside. This dimensional transition allows circuits to be positioned outside the display area while maintaining direct electrical connection through the vertical connection path.
Data Source
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AI summary
A display device (10) is provided. The display device (1) includes an auxiliary substrate (200), a display substrate (100), and a circuit board (300). The auxiliary substrate (200) includes an auxiliary circuit (202). The display substrate (100) is disposed on the auxiliary substrate (200). The display substrate (100) includes a circuit (102). The circuit board (300) is electrically connected to the auxiliary substrate (200). The circuit (102) of the display substrate (100) is electrically connected to the auxiliary circuit (202) through a first conductive via (104), and the circuit board (300) provides a signal to the auxiliary circuit (202).