Stacked PCBs TRIZ Cases

A segmented soldering layout with 100+ connection points and outward strips supports different module sizes without hardware redesign.

Bridge and partition boards expand PCB weld legs perpendicular to a narrow functional board while preventing pad short circuits.

Embedded power chips with stacked conductive and insulating layers enable adjustable board curvature and stronger heat dissipation.

Fine conductor layers with 3 μm pitch and controlled aspect ratio improve high-density routing while reducing defects and signal loss.

A rigid-flex circuit links ICs to port connectors across both PCB sides, cutting signal loss and improving signal integrity.

Side-surface grooves create three-sided pads and solder-filled joints that boost circuit board connection reliability without using more surface area.

A nested two-substrate layout with protrusion pads cuts camera sensor driver size and power use while preserving reliable autofocus connections.

A stacked substrate with multi-directional protrusions shortens electrical paths, shrinking camera sensor drivers while lowering power use.

Planar coils on stacked PCBs with a through-core cut module height, widen routing space, and reduce EMI in DC-DC converter modules.

A two-substrate trace layout separates touch and display signals to cut interference, lower FPC layer count, and free backside space.

Multiple via-filled through holes create shorter parallel conduction paths, improving connection reliability without increasing device area.

Overlapping substrates with multi-direction protrusions shrink the sensor driver and cut power use while preserving autofocus and image stabilization.

Multiple pillars split one large air gap into smaller gaps, cutting magnetic loss and leakage inductance in thin magnetic assemblies.

A filler piece bridges aluminum and copper pads across covering-film gaps to prevent virtual welding and improve joint reliability.

A wear-compensating damper head supports stacked thin parts at pin holes to prevent punching deformation during repeated assembly cycles.

By routing panel connections through an auxiliary substrate and backside via, this case cuts tiling gaps and preserves display area in high-resolution panels.

Insertable broaching pins replace screws in CAMM mounting to prevent torque damage, speed assembly, and keep contacts evenly compressed.

A hybrid-layer Type-3 PCB uses added core layers and sequential lamination to shorten via stubs, improving high-speed signal integrity.

Overlapping first and second supports reinforce flexible circuit boards, preventing edge sagging and panel interference during display assembly.

A flexible circuit board carries a temperature sensor and conducts switch heat laterally for economical monitoring on a ceramic carrier.

Grooves recess two cameras while an external board redistributes wiring, reducing module height and width for thin devices.

This wiring board uses a rigid-sided cavity and flexible top to reduce capacitive coupling, cracks, and volume variation.

This case uses conductive nanowires for metal diffusion bonding, reducing heat-related warping and cracking in glass via fabrication.

Stacked circuit boards and an avoidance opening accommodate tall connectors, reducing protrusion and supporting thinner electronic devices.

A circuit board design uses stacked sub-board layers to arrange daughter boards vertically, enabling denser component population within a standard footprint.

A substrate spacing member holds electronic components between two substrates using branch holding portions and a frame body.

Mechanical fasteners extend through stacked component carriers to prevent warpage and ensure stable Z-direction interconnections.

Edge insulation coating resolves the trade-off between usable area and reliability by enabling copper layers to extend fully to the board perimeter.

A solid state transformer stack-up structure integrates a thermally conductive insulating layer with a heat diffusion layer to manage thermal energy.

Segmenting large-area PCBs from precision wafer-fabricated microdevices resolves the contradiction between manufacturing precision and device area constraints.

Stacked wiring substrates with through holes and cutouts align input portions on a single plane, simplifying wire drawing in high-density inkjet printers.

A segmented circuit board uses movably connected supporting portions to enable flexible bending while maintaining electrical connectivity between integrated circuit layers.

Conductive bonding material joins substrate electrodes at temperatures below the thermoplastic resin glass transition point.

A dummy pad with a partially exposed region connects to a connector via solder balls.

Non-overlapping circuit board arrangement eliminates friction-induced defects and improves contrast by preventing light leakage in stacked display modules.

Vertical planar power modules remove board-level planes to reduce component volume and clear airflow paths in high-density servers.

A flexible circuit board integrates display signal lines and a fingerprint sensor to consolidate components within a display assembly.

A supporting board with dislocated primary and secondary conductive elements connects electronic units to a circuit layer.

Segmenting the substrate and adding a resin side cover prevents defects while routing heat away from multichip packages.

Segmented insulation walls prevent short circuits while maintaining bonding area and impedance characteristics.

Integrally formed circuit board portions connect via conductive assemblies and engaging components to resolve warpage issues in large-area production.

A flexible printed circuit film tail extends to the display front surface.

Vertical stacking of circuit substrates shortens signal paths and reduces electrical disturbances to resolve signal integrity issues in dense PCB assemblies.

A printed circuit board uses a bonding layer containing conductive particles to electrically connect passive components embedded in separate core portions.

Fiducial marks on core layers expose sequencing errors and misalignment at the PCB edge, enabling visual verification without electrical testing.