Segmented PCB with Resin Side Cover for AI Multichip Heat Dissipation
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Solution Overview
Problem
Existing printed circuit boards face challenges in preventing defects, improving yield, and enhancing heat dissipation characteristics, especially when mounting multichip packages for data processing in AI technology.
Innovation Solution
The printed circuit board design includes a first substrate portion with insulating and wiring layers, a resin layer covering the side surface, and a second substrate portion with additional insulating and wiring layers, which improves structural integrity and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional printed circuit board structure is used, then the manufacturing process is simple, but defects occur and yield is reduced
Solution Approach 1:
The printed circuit board is divided into a first substrate portion and a second substrate portion that are coupled together. The first substrate portion includes a first insulating portion with first wiring layers, while the second substrate portion includes a second insulating portion with second wiring layers. This segmentation allows independent optimization of each substrate portion, preventing defects while maintaining manufacturing feasibility.
Solution Approach 2:
The invention uses composite material structures where the first and second substrate portions are coupled through a coupling portion that may include resin layers and conductive patterns. This composite structure combines the advantages of different material properties to improve yield and prevent defects while managing the complexity through systematic material integration.
2Productivity
If multichip packages are mounted for AI data processing, then data processing capability increases, but heat dissipation becomes problematic
Solution Approach 1:
The invention addresses heat dissipation by extending the thermal management solution into the vertical dimension. The coupling portion between the first and second substrate portions provides thermal pathways that conduct heat away from the multichip packages. The resin layers and conductive patterns are arranged in three-dimensional configurations to create efficient heat dissipation routes without limiting the data processing capability.
3Adaptability or versatility
If fine circuits are implemented on the board, then multichip packages can be mounted, but manufacturing defects increase
Solution Approach 1:
By segmenting the circuit board into first and second substrate portions with separate insulating and wiring layers, the invention allows fine circuits to be implemented on each portion independently. This segmentation reduces the complexity of manufacturing fine circuits across the entire board, thereby reducing defect rates while maintaining the capability to mount multichip packages.
Data Source
AI summary
A printed circuit board includes a first substrate portion including a first insulating portion and a plurality of first wiring layers respectively disposed on or in the first insulating portion, a resin layer disposed to cover a side surface of the first insulating portion, and a second substrate portion including a second insulating portion disposed to cover each of an upper surface of the first insulating portion and an upper surface of the resin layer, and a second wiring layer disposed on or in the second insulating portion.