Wiring Substrate Unit Stacked Design for Inkjet Printers
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Solution Overview
Problem
In high-density recording apparatuses, such as ink-jet printers, the complexity of wiring substrates increases due to numerous contact points, making it difficult to draw wires efficiently from input portions to output contact points, and requires separate signal supply connections for each input portion.
Innovation Solution
A wiring substrate unit is configured with two stacked substrates, where one substrate has through holes to expose output contact points and cutouts to align input portions on the same plane, allowing wires to be drawn separately and simplifying the connection to a single signal supply portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of recording elements is increased and arranged in high density, then high-speed printing and high-resolution printing requirements are met, but the complexity of wiring substrate increases and it becomes difficult to draw wires from input portion to contact points
Solution Approach 1:
The wiring substrate is divided into multiple separate substrates, each handling a subset of the total contact points. This segmentation reduces the complexity of individual substrates, making wire drawing and manufacturing easier while still supporting the high density of recording elements required for high-speed and high-resolution printing
Solution Approach 2:
The patent transitions from a single-plane wiring arrangement to a three-dimensional stacked configuration. Multiple wiring substrates are arranged in the vertical dimension, allowing wires to be drawn more easily on each individual substrate while collectively serving all high-density contact points through the stacked architecture
2Ease of manufacture
If two wiring substrates are stacked with input portions shifted or separated in the stacked direction, then wire drawing is simplified, but separate signal supply portions are required and connection becomes more complex
Solution Approach 1:
The input portions of multiple wiring substrates are aligned and merged into a single plane, allowing them to be connected to a unified signal supply portion. This combining approach maintains the manufacturing ease of separate substrates while eliminating the need for multiple separate signal supply connections
Solution Approach 2:
The patent uses vertical stacking to separate output functions while maintaining horizontal alignment of input functions. The stacked arrangement in the vertical dimension allows each substrate to have its own output contact points for easy wire drawing, while the aligned input portions in the horizontal dimension enable unified signal supply connection
Data Source
AI summary
A wiring substrate unit is provided. The unit includes: first and second wiring substrates, first and second input portions respectively formed in marginal portions of the first and second wiring substrates, and first and second output contact points respectively formed on one surfaces of the first and second wiring substrates. A through hole is formed in the first wiring substrate to correspond to the second output contact point; a cutout is formed either at a position adjacent to the first input portion of the marginal portion of the first wiring substrate or at a position adjacent to the second input portion of the marginal portion of the second wiring substrate; and one of the first and second input portions is exposed from the cutout.