Ceramic Power Module Temperature Sensing via Flexible Circuit Board
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power modules lack an economical and efficient method to sense the temperature of semiconductor switches, which is crucial for managing heat loss and ensuring reliable operation.
Innovation Solution
Incorporating a flexible circuit board with a temperature sensor that is soldered or glued to the circuit carrier, allowing heat loss from semiconductor switches to be conducted laterally to the sensor, while also serving as a fastening means and enabling control signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is integrated into the power module to sense semiconductor switch temperature, then temperature monitoring capability is improved, but device complexity increases
Solution Approach 1:
The temperature sensor is integrated directly onto the circuit carrier in the immediate vicinity of the semiconductor switches, merging the sensing function with the existing power module structure. This eliminates the need for separate external temperature sensing systems and reduces overall device complexity while maintaining accurate temperature monitoring capability.
Solution Approach 2:
The circuit carrier serves as an intermediary structure that both supports the semiconductor switches and integrates the temperature sensor. The carrier acts as a mediator that enables temperature sensing without requiring additional complex mounting structures or separate sensing systems.
2Measurement precision
If the temperature sensor is placed close to the semiconductor switches for accurate measurement, then measurement precision is improved, but heat loss conduction path becomes more complex
Solution Approach 1:
The circuit carrier is designed with localized thermal conduction paths that directly connect the semiconductor switch mounting areas to the temperature sensor location. This creates optimized local heat flow paths without requiring complex global thermal management structures, enabling accurate temperature sensing while maintaining simple heat conduction pathways.
3Ease of manufacture
If the flexible circuit board is used for sensor mounting and control signals, then ease of manufacture is improved, but manufacturing precision requirements increase
Solution Approach 1:
The flexible circuit board serves multiple functions simultaneously: it provides mechanical support for the temperature sensor, establishes electrical connections for control signals, and facilitates thermal conduction. This multi-functionality simplifies the manufacturing process by using a single component for multiple purposes, though it does require precise soldering to achieve all functions correctly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables economical temperature sensing of semiconductor switches, facilitating heat management and reliable operation by conducting heat loss efficiently and allowing control signal feeding to the switches.
Implementation Method 1
The heat loss generated by the semiconductor switches can thus be conducted along a flat extension of the circuit carrier, i.e., laterally, to a location of the circuit carrier on which the temperature sensor is arranged
Implementation Method 2
a temperature sensor, which is integrally connected to the flexible circuit board and is designed and arranged to sense a temperature of the circuit carrier in the area of the semiconductor switches
Implementation Method 3
The temperature sensor is preferably soldered to the flexible circuit board, in particular reflow-soldered
Implementation Method 4
the temperature sensor may be sintered to the flexible circuit board by means of a sintering material. For example, the sintering material may be a sintering paste, in particular a silver sintering paste
Data Source
AI summary
A power module, in particular a commutation cell for an inverter. The power module includes a circuit carrier, in particular a ceramic circuit carrier, and at least one or only one semiconductor switch half-bridge with two semiconductor switches, in particular power semiconductor switches, wherein the semiconductor switches are in particular integrally connected to the circuit carrier. The power module of the above-mentioned type includes a flexible circuit board, which is in particular integrally connected to the circuit carrier. The flexible circuit board is arranged in the area of the semiconductor switches. The power module comprises a temperature sensor, which is integrally connected to the flexible circuit board and is designed and arranged to sense a temperature of the circuit carrier in the area of the semiconductor switches, and in particular thus indirectly a temperature of the semiconductor switches, through the flexible circuit board.