Segmented Circuit Board with Movable Supporting Portions
Solution Overview
Problem
Flexible printed circuits (FPCs) used in applications requiring frequent bending and movement are prone to damage and breakage due to bending fatigue, as the repeated stress leads to material degradation and potential fractures in the circuit layers.
Innovation Solution
A circuit board design featuring movably connected supporting portions with integrated circuit layers, allowing for flexible bending without direct stress on the circuit layers, achieved through the use of insulating materials and conductive elements for electrical connectivity, and optionally incorporating elastic elements and locking mechanisms for enhanced stability and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If FPC is used for frequent bending and movement, then flexibility and adaptability are improved, but reliability deteriorates due to bending fatigue and material degradation
Solution Approach 1:
The circuit board is divided into multiple supporting portions that can move independently relative to each other. Each supporting portion maintains structural integrity while the segmented design allows the overall board to bend and adapt to different positions without subjecting the circuit layers to excessive stress, thereby maintaining both flexibility and reliability
Solution Approach 2:
The supporting portions are designed to be movable relative to each other, transforming the rigid circuit board into a dynamic structure. This allows the circuit board to adapt its shape and position during operation while the circuit layers remain protected from bending fatigue through the movable connection mechanism
2Device complexity
If circuit layers are directly formed on flexible substrate, then integration is improved, but strength deteriorates due to direct stress on circuit layers during bending
Solution Approach 1:
The circuit board structure is segmented into multiple supporting portions with movable connections. The circuit layers are formed on each supporting portion separately, allowing each segment to move independently without transmitting bending stress directly to the circuit layers, thus maintaining both integration and strength
Solution Approach 2:
The movable connection structure acts as an intermediary between the supporting portions. This intermediary mechanism allows relative movement between segments while protecting the circuit layers from direct stress during bending operations, maintaining circuit integrity while enabling flexibility
Data Source
AI summary
A first circuit board includes: at least two supporting portions, where two adjacent supporting portions are movably connected; and a circuit layer formed on each of the supporting portions, where the circuit layers on the two adjacent supporting portions are electrically connected; and where the at least two supporting portions are configured to form a bending region of the circuit board.