Circuit Board Pad Groove Structure for Reliable Solder Joints
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Solution Overview
Problem
The size limitation of pads on circuit boards reduces the strength of connections between the circuit board and electronic components, necessitating an improvement in connection reliability.
Innovation Solution
The implementation of grooves on the side surfaces of circuit board substrates to accommodate pads with multiple welding surfaces, increasing the welding area and enhancing the connection reliability through the use of solder-filled receiving grooves and additional pads that extend to increase contact points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pad size is increased to improve connection strength, then the connection reliability improves, but the available space on the circuit board surface is reduced
Solution Approach 1:
The pad structure transitions from a two-dimensional surface configuration to a three-dimensional multi-level structure by forming receiving grooves on the circuit board. The pad extends into the groove to create multiple welding surfaces (first welding surface on the front surface, second welding surface on the rear surface, and third welding surface on the side surface), effectively utilizing spatial volume rather than just surface area to achieve enhanced connection strength without occupying additional board space.
2Strength
If multiple welding surfaces are created to increase welding area, then the connection strength improves, but the manufacturing process complexity increases
Solution Approach 1:
The pad is segmented into multiple distinct welding surfaces located at different positions: the first welding surface on the front surface of the circuit board, the second welding surface on the rear surface, and the third welding surface on the side surface within the receiving groove. This segmentation allows each surface to contribute independently to the overall connection strength, with the solder distributed across multiple contact points rather than concentrated at a single location.
Solution Approach 2:
The pad structure is nested within the receiving groove formed on the circuit board. The groove provides a cavity that accommodates the pad, allowing the pad to extend into the groove and form multiple welding surfaces. This nesting arrangement maximizes the utilization of the available space within the groove, enabling the pad to create extensive welding contact areas (front surface, rear surface, and side surface) while maintaining a compact overall structure that does not increase the external dimensions of the circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced welding area and additional contact points improve the stability and reliability of connections between circuit boards and external circuit boards, ensuring robust electrical connections.
Implementation Method 1
at least one receiving groove 235 is formed on the first pad 20
Data Source
AI summary
A circuit board assembly includes a first substrate and at least one first pad. The first substrate includes a first surface, a second surface, and a side surface. The first surface and the second surface are opposite to each other along a first direction, the side surface connects the first surface to the second surface, a groove is defined on the side surface and extending through the first surface and the second surface. Each first pad is accommodated in a corresponding groove of the groove and connects to a groove wall of the groove, each first pad includes a first welding surface, a second welding surface, and a third welding surface, the first welding surface connects the first surface, the second welding surface connects the second surface, the third welding surface connects the first welding surface to the second welding surface. The present disclosure further provides a terminal device.