Printed Circuit Assembly Support Layout to Prevent FPC Sagging

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Solution Overview

Problem

Existing display apparatuses face challenges in maintaining structural rigidity and preventing premature contact between flexible circuit boards and display panels, particularly at the edges and corners where bending occurs, leading to potential sagging and interference during manufacturing processes.

Innovation Solution

A printed circuit assembly is designed with a first support and a second support, where the second support overlaps a smaller area of the first support and provides additional structural rigidity, while a second circuit board is connected to the first circuit board outside the support periphery, with a connector extending beyond the first support to secure the assembly and prevent sagging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a flexible circuit board is used to transmit electrical signals, then adaptability and ease of connection are improved, but structural rigidity deteriorates causing sagging at edges and corners

Engineering Contradiction:
Improveflexibility of circuit boardVSAvoidstructural rigidity
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The support structure is divided into multiple segments: a first support extending along a first direction and a second support extending along a second direction perpendicular to the first direction. This segmentation allows each support to provide localized reinforcement, preventing sagging at specific locations while maintaining the overall flexibility of the circuit board assembly.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention uses a composite support structure combining a first support and a second support with different orientations and extensions. This composite structure provides multi-directional reinforcement to the flexible circuit board, enhancing structural rigidity where needed while preserving flexibility in other areas.

Inventive Principle:
Principle #40Composite materials

2Ease of operation

If the circuit board is made flexible for bending and positioning, then ease of operation and installation are improved, but reliability deteriorates due to premature contact and interference

Engineering Contradiction:
Improvebending and positioning capabilityVSAvoidprevention of premature contact
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The first support and second support are positioned in advance to define a safe zone that prevents the flexible circuit board from contacting the display panel prematurely. This preliminary structural arrangement ensures that during subsequent bending and positioning operations, the circuit board maintains proper clearance and avoids interference.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The first support and second support act as intermediary structures between the flexible circuit board and the display panel. These supports maintain the circuit board in a controlled state during handling and installation, preventing direct contact with the display panel while allowing necessary bending and positioning operations to proceed.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If supports are added to prevent sagging, then structural rigidity and reliability are improved, but device complexity increases

Engineering Contradiction:
Improveprevention of saggingVSAvoidnumber of support structures
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Instead of using a single complex support structure, the invention segments the support function into a first support extending in a first direction and a second support extending in a perpendicular second direction. This segmentation simplifies the overall design by using simpler, orthogonal components rather than a single complex three-dimensional structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first support and second support are positioned at specific locations on the flexible circuit board where sagging is most likely to occur. This localized approach provides targeted reinforcement without requiring comprehensive support across the entire board, thereby reducing overall device complexity while maintaining reliability.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20260013046A1Printed circuit assembly and method of manufacturing electronic apparatus by using the same
Publication Date: 2026.01.08 SAMSUNG DISPLAY CO LTD
  • US20260013046A1 patent drawing
  • US20260013046A1 patent drawing
  • US20260013046A1 patent drawing

AI summary

A printed circuit assembly includes a first support, a first circuit board overlapping a first area of the first support and attached to a first surface of the first support, a second circuit board overlapping a second area of the first support and attached to the first surface of the first support, and a second support overlapping the first area and the second area of the first support and attached to a second surface of the first support.