Scalable Soldering Board Layout for Variable-Size Module Interfaces
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Solution Overview
Problem
Existing soldering board arrangements with standard form factors like Qseven, Smarc, and OSM have limited design flexibility and scalability, restricting the freedom of design and adaptability to evolving interfaces and functionalities.
Innovation Solution
A soldering board arrangement with a base board featuring a holding section that includes over 100 soldering connection points, allowing for flexible placement and scalability through soldering connection strips extending from the center to the corners, enabling modules of varying sizes and functionalities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If standard form factors like Qseven, Smarc, or OSM are used, then device compatibility and interchangeability are improved, but design flexibility and adaptability to evolving interfaces are restricted
Solution Approach 1:
The base board is segmented into a holding section with a standardized grid of soldering connection points and extension regions. This segmentation allows the module to maintain a standardized interface while enabling flexible configuration of additional connection points for evolving interfaces and functionalities without requiring complete hardware redesign.
Solution Approach 2:
The patent extends the traditional two-dimensional array of soldering connection points into a three-dimensional configurable space by adding extension regions that can be activated selectively. This dimensional expansion allows designers to add functionalities in the spatial domain rather than requiring complete redesign of the entire interface layout.
2Productivity
If fixed-size modules are used, then manufacturing and assembly are simplified, but scalability to different computing power requirements is limited
Solution Approach 1:
The module design transitions from a static fixed-size configuration to a dynamic configurable architecture where the active area can be selectively extended. The holding section with standardized grid points combined with extendable regions enables the same base module to adapt to different size requirements through selective activation of connection points, maintaining assembly efficiency while providing scalability.
Solution Approach 2:
The patent enables parameter changes in module size and configuration by providing a standardized grid of soldering connection points that can be selectively activated. This allows the physical and functional parameters of the module to be adjusted without changing the fundamental module architecture, facilitating scalability while maintaining manufacturing simplicity.
3Adaptability or versatility
If custom interfaces and functionalities are added, then system capability is enhanced, but development effort and planning complexity increase
Solution Approach 1:
The base board is pre-configured with a standardized grid of soldering connection points in the holding section and extension regions. This preliminary preparation of the connection infrastructure eliminates the need for custom interface design and planning during later development stages, as designers can simply activate pre-positioned connection points to add functionalities without increasing development effort.
Data Source
AI summary
A soldering board arrangement has a base board, which has a holding section that has a plurality of more than 100 soldering connection points for electrical contacting for a soldering board module. The holding section has soldering connection strips that differ from the soldering connection points. The strips extend outward from the direction of a center of the holding section, and allow soldering to corners of soldering board modules of different sizes.