Glass Substrate Bonding with Conductive Nanowires for High-Aspect-Ratio Vias
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Solution Overview
Problem
Existing methods face challenges in producing high aspect ratio through glass vias in glass substrates, particularly due to the use of resin materials and high temperatures that can cause warping and cracking.
Innovation Solution
A manufacturing method involving conductive nano-wires, such as copper nano-wires, is used to bond substrates with metal diffusion and covalent bonding interfaces, allowing for lower heating temperatures and improved quality of through glass vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin material is used to bond glass substrates and conductive paste is used to connect through glass vias, then electrical connection is achieved, but the manufacturing process becomes complex and requires additional materials
Solution Approach 1:
The patent combines the bonding function and electrical connection function into a single component. The conductive nano-wires serve both as the bonding material between glass substrates and as the electrical conductor, eliminating the need for separate resin material and conductive paste layers. This merging of functions simplifies the manufacturing process while maintaining reliable electrical connection.
Solution Approach 2:
The patent extracts the bonding function from the resin material and transfers it to the conductive nano-wires. By taking out the bonding capability from the traditional resin-based system and incorporating it into the conductive nano-wire structure, the invention eliminates the need for separate bonding and conductive materials, thereby simplifying the overall manufacturing process.
2Strength
If high temperature is used during bonding process, then bonding strength is improved, but warping and cracking of substrates occur
Solution Approach 1:
The patent changes the thermal parameters of the bonding process by using conductive nano-wires with low melting points. This material parameter change allows bonding to occur at lower temperatures (below the melting point of the nano-wires), thereby achieving sufficient bonding strength without causing thermal damage such as warping and cracking to the glass substrates.
Solution Approach 2:
The conductive nano-wires act as a sacrificial material that undergoes phase change during bonding. These nano-wires are designed to melt and flow at relatively low temperatures, temporarily serving as a bonding medium that then solidifies to create the bond. This approach allows strong bonding without exposing the substrate to high temperatures that would cause damage.
3Manufacturing precision
If conventional bonding methods are used, then substrates can be bonded, but through glass vias with high aspect ratios cannot be produced
Solution Approach 1:
The patent replaces mechanical drilling or laser drilling methods with a chemical/electrochemical deposition process. Conductive nano-wires are grown or deposited directly into the via holes, filling them with conductive material. This substitution of the manufacturing mechanism enables precise formation of high aspect ratio vias that would be difficult or impossible to achieve with conventional mechanical or thermal methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces the risk of warping and cracking by using conductive nano-wires with low melting points, enabling the production of high aspect ratio through glass vias at lower temperatures.
Implementation Method 1
the first substrate and the second substrate are bonded by at least conductive diffusion bonding formed by the conductive nano-wires
Implementation Method 2
because conductive nano-wires have the characteristics of low melting point and high surface area, the temperature in the manufacturing process operation may be reduced
Implementation Method 3
the polymer is further located between the first core layer and the second core layer, so that the first substrate and the second substrate are further bonded through a chain or network structure formed by the polymer
Data Source
AI summary
A substrate structure including a first substrate and a second substrate is provided. The first substrate includes a first core layer and a first conductor. The second substrate includes a second core layer and a second conductor. There is a metal diffusion bonding interface between the first conductor and the second conductor. There is a covalent bonding interface between the first core layer and the second core layer.