Solid State Transformer PCB Stack-Up for Heat Dissipation
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Solution Overview
Problem
The existing assembly process for high-power power devices on printed circuit boards is time-consuming due to the need for multiple applications of thermal paste and is prone to errors that can damage the insulating material, leading to inadequate heat dissipation.
Innovation Solution
A stack-up structure for printed circuit boards that includes a plate, a power device, a thermally conductive insulating layer, a heat diffusion layer, and a thermal conductor, where the thermally conductive insulating layer is pressed to combine with the plate and the heat diffusion layer covers it, forming a heat conducting path for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional heat dissipation assembly process is used with separate insulating layer and thermal paste applications, then insulation effect is achieved, but manufacturing time increases and risk of human error increases
Solution Approach 1:
The patent combines the insulating layer and thermal paste into a single integrated thermally conductive insulating layer. This layer simultaneously provides electrical insulation between the heat dissipation device and motherboard while conducting heat away from the power device, eliminating the need for separate insulating layer and thermal paste applications, thus reducing manufacturing steps and time while maintaining reliable insulation
Solution Approach 2:
The thermally conductive insulating layer serves multiple functions simultaneously: it provides electrical insulation to prevent short circuits, conducts heat away from the power device through its thermal conductivity, and eliminates the need for separate thermal paste application. This multi-functional design reduces complexity and potential for human error in the assembly process
2Reliability
If traditional assembly process with separate insulating layer is used, then insulation is provided, but the insulating material is prone to damage by human operation errors
Solution Approach 1:
By merging the insulating layer and thermal paste into a single pre-fabricated thermally conductive insulating layer component, the patent eliminates multiple manual assembly steps where human errors could occur. The integrated layer is simply positioned and attached in one step, reducing the complexity of the assembly process while ensuring the insulation effect is maintained through the inherent properties of the combined material structure
3Temperature
If multiple thermal paste applications are required, then heat dissipation is achieved, but the manufacturing process becomes time-consuming
Solution Approach 1:
The patent merges the thermal paste function into the thermally conductive insulating layer itself, which has inherent thermal conductivity properties. This eliminates the need for multiple thermal paste applications and allows heat dissipation to occur through the integrated layer structure, significantly improving manufacturing efficiency while maintaining effective heat dissipation from the power device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the number of thermal paste applications required, minimizes the risk of damage to the insulating material during assembly, and enhances heat dissipation by creating a uniform heat path along the plate, thereby improving the overall efficiency of heat dissipation.
Implementation Method 1
The thermally conductive insulating layer covers the second surface and is pressed to combine with the second surface
Implementation Method 2
The heat diffusion layer covers the thermally conductive insulating layer and is pressed to combine with the thermally conductive insulating layer
Implementation Method 3
The thermal conductor is embedded in the plate and connected with the power device and the thermally conductive insulating layer, respectively
Data Source
AI summary
This disclosure is directed to a solid state transformer and a printed circuit board stack-up structure, the printed circuit board stack-up structure has a plate, a power device, a thermally conductive insulating layer, a heat diffusion layer and a thermal conductor. The plate has a first surface and a second surface respectively disposed at two sides. The power device is arranged on the first surface. The thermally conductive insulating layer is pressed to combine with the second surface and cover the second surface. The heat diffusion layer is pressed to combine with the thermally conductive insulating layer and cover the thermally conductive insulating layer. The thermal conductor is embedded in the plate and respectively connected to the power device and the thermally conductive insulating layer.