Dislocated Conductive Elements for Compact Electronic Device Repair
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Solution Overview
Problem
Conventional Surface Mount Technology (SMT) for electronic device manufacturing faces challenges in efficiently connecting electronic components to circuit boards, particularly in achieving high density and ease of repair, while maintaining a compact size and visual consistency.
Innovation Solution
The proposed solution involves an electronic device design with a supporting board and an electrical board, where primary conductive elements on the electrical board connect to a circuit layer, and secondary conductive elements on electronic units connect to the electrical layer, arranged in a dislocation pattern to allow for efficient electrical connection and easy replacement of defective units, enabling high-density packaging and visual consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional SMT is used to solder electronic components to circuit boards, then electronic components can be connected to the circuit board, but the device size cannot be sufficiently reduced and repairability is difficult
Solution Approach 1:
The electronic component is divided into a module that can be independently replaced. The supporting board is segmented into regions with through-holes positioned at corners, allowing individual module replacement rather than entire device replacement, thus improving repairability while maintaining compact size.
Solution Approach 2:
The electronic module is nested within the supporting board structure, with the module containing the electronic component and its own conductive elements that connect to the board's through-holes. This nested arrangement reduces overall device volume while enabling easy module extraction and replacement for repair.
2Volume of moving object
If electronic components are densely packed on the circuit board, then device size is reduced, but manufacturing precision and alignment become more difficult
Solution Approach 1:
Through-holes are positioned asymmetrically at the corners of the supporting board rather than in a uniform grid pattern. This asymmetric corner positioning provides natural alignment references that simplify the placement and alignment of electronic modules, maintaining manufacturing precision even as device size is reduced through dense packing.
Solution Approach 2:
The connection structure extends into the vertical dimension with through-holes penetrating the supporting board. This three-dimensional arrangement allows electrical connection without requiring precise planar alignment in the same dimension as conventional SMT, enabling denser packing while maintaining alignment precision through the vertical through-hole pathway.
Data Source
AI summary
An electronic device includes a supporting board, an electrical board and electronic units. The supporting board includes a circuit layer. The electrical board has a board body, through holes through the board body, an electrical layer on the board body, and primary conductive elements respectively in the through holes. The board body has opposite first and second surfaces. The through holes communicate with the first surface and the second surface. The primary conductive elements electrically connect the electrical layer to the circuit layer. The electronic units are arranged on the first surface. Each electronic unit partially overlaps with one corresponding through hole in a projection direction of the electrical board. Each electronic unit has an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer. The secondary conductive elements and the primary conductive elements are arranged in dislocation in the projection direction.