Planar Power Modules for Server Chassis Airflow Optimization
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Solution Overview
Problem
Conventional power delivery systems in information handling systems face challenges with increasing power density and signal routing complexity, leading to space inefficiency, heat dissipation issues, and design complexity, particularly in server devices with high power CPUs and GPUs.
Innovation Solution
The implementation of a power delivery system using planar power modules and connectors located between the chassis and circuit boards, which transmit power through planar power modules and connectors, eliminating the need for power planes on the circuit boards and allowing for direct power transmission to components, thereby optimizing space and airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power cabling and power planes are used to deliver power within the chassis, then power can be transmitted to components, but the volume occupied by power delivery components increases and heat dissipation is compromised
Solution Approach 1:
The patent extracts the power delivery function from the circuit board by removing power planes and power cabling from the traditional locations. Instead, planar power modules are placed between the chassis and circuit board, separating power transmission from signal routing paths and reducing the volume occupied by power delivery components.
Solution Approach 2:
The patent transitions from planar power delivery (on the circuit board surface) to a three-dimensional power delivery approach by placing planar power modules in the space between the chassis and circuit board. This vertical arrangement reduces the horizontal footprint and improves airflow through the chassis.
2Power
If power planes are integrated into circuit boards to deliver power, then power distribution is achieved, but high-speed signal routing becomes difficult and design complexity increases
Solution Approach 1:
The patent extracts the power delivery function from the circuit board's signal layers. By placing planar power modules between the chassis and circuit board, the design separates power transmission from high-speed signal routing, eliminating the need for complex power planes and reducing overall design complexity.
3Power
If busbars are provided on the motherboard to deliver power, then power delivery is enabled without power planes, but space is consumed and component positioning is impacted
Solution Approach 1:
Instead of placing busbars on the circuit board surface (2D plane), the patent positions planar power modules in the vertical space between the chassis and circuit board. This three-dimensional arrangement reduces the horizontal space occupied and does not interfere with component positioning on the circuit board.
4Power
If conventional power delivery components are used throughout the chassis, then power can be delivered to all components, but airflow is blocked and heat dissipation is reduced
Solution Approach 1:
The patent positions planar power modules in the vertical space between the chassis and circuit board, allowing airflow to pass through the chassis uninterrupted. This three-dimensional arrangement maintains power delivery coverage while preserving heat dissipation pathways that would be blocked by traditional planar power delivery components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the volume occupied by power delivery components, minimizes airflow restrictions, and simplifies circuit board design, while maintaining efficient power distribution without interfering with high-speed signal routing.
Implementation Method 1
a first power transmission coupling engaging the first transmission pad included on the circuit board and at least one of the first planar power module and the second planar power module, wherein the first power transmission coupling is configured to receive the power from the at least one of the first planar power module and the second planar power module to which the first power transmission coupling is engaged, and transmit the power via the first transmission pad to the first component on the circuit board
Data Source
AI summary
A power delivery system includes a first planar power module that is coupled to a power system and that transmits power received from the power system. A first planar power module connector is connected to the first planar power module and transmits the power received from the first planar power module. A second planar power module is connected to the first planar power module connector and transmits the power received from the first planar power module connector. A first power transmission coupling engages at least one of the first planar power module and the second planar power module, and receives the power from the at least one of the first planar power module and the second planar power module to which it is engaged, and transmits the power to a first component via a first power transmission pad coupled to the first component and engaging the first power transmission coupling.