Stacked Sub-Board Circuit Board Design for Dense Component Population
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Solution Overview
Problem
Existing computer motherboard designs with multilayer settings to accommodate signal transmission lines increase product costs and occupy limited space, necessitating a more efficient use of space and cost-effective solution.
Innovation Solution
A circuit board design featuring a mother board with stacked sub-board layers and flexible printed circuit boards, where components are arranged on both sides of the layers and connected via pads and conductive vias, with enhanced soldering capabilities and grooves for easy cutting, allowing for a denser component population within a standard footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer device setting is used to meet wiring requirements of signal transmission lines, then signal transmission capability is improved, but product cost increases and available space is reduced
Solution Approach 1:
The circuit board is divided into a mother board and multiple sub-board layers that can be stacked and arranged flexibly. This segmentation allows signal transmission requirements to be met through strategic layer arrangement rather than requiring a complex multilayer structure throughout, thereby reducing manufacturing cost while maintaining signal integrity.
Solution Approach 2:
The patent transitions from a traditional planar multilayer approach to a three-dimensional stacked configuration with sub-board layers positioned at different heights and angles relative to the mother board. This dimensional change enables efficient signal routing and component placement without increasing the footprint area, thus maintaining signal transmission capability while optimizing space utilization.
2Reliability
If a multilayer device setting is used to meet wiring requirements of signal transmission lines, then signal transmission capability is improved, but available space on the main board is reduced
Solution Approach 1:
By stacking sub-board layers vertically and positioning them at different heights above the mother board, the design utilizes the third dimension (Z-axis) for signal routing and component placement. This approach maintains signal transmission capability while preserving maximum horizontal space on the main board for additional components or reduced overall footprint.
Solution Approach 2:
The sub-board layers are designed as flexible printed circuit boards that can be positioned and connected to the mother board at various orientations. This flexibility allows optimal space utilization by routing signals through three-dimensional space rather than consuming valuable horizontal board area, thus maintaining signal integrity while maximizing available space.
3Area of stationary object
If components are arranged densely within a standard footprint, then space usage is optimized, but manufacturing complexity increases
Solution Approach 1:
The circuit board system is segmented into a mother board and multiple detachable sub-board layers. This segmentation allows components to be distributed across multiple layers, enabling dense packing within a standard footprint while simplifying manufacturing. Each layer can be manufactured and tested independently before final assembly, reducing overall manufacturing complexity despite the dense final configuration.
Data Source
AI summary
A circuit board optimized for a denser component population within a standard size of footprint includes a mother board and a plurality of sub-board layers stacked on and connected to the mother board. Each of the sub-board layers has a plurality of daughter boards. The sub-board layers are composed of a first sub-board layer and a second sub-board layer. The daughter boards of the first sub-board layer are arranged on a side of the mother board, and the daughter boards of the second sub-board layer are arranged on the daughter boards of the first sub-board layer.