Bonding Layer with Conductive Particles for Embedded Passive Substrate
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Solution Overview
Problem
Existing printed circuit boards face challenges in implementing the Embedded Passive Substrate (EPS) structure effectively, particularly in securing Power Integrity (PI) characteristics and introducing via connections through a build-up process.
Innovation Solution
The solution involves embedding passive components in multiple core portions and bonding them vertically using a bonding layer containing conductive particles, which facilitates easier implementation of the EPS structure and improves PI characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive components are mounted on the surface of the board using DSC or LSC structures, then Power Integrity (PI) characteristics can be secured, but the complexity of the board structure increases and manufacturing becomes more difficult
Solution Approach 1:
The patent merges the passive component with the core substrate itself by embedding passive components directly into the core portions during the substrate manufacturing process. This integration eliminates the need for separate mounting structures like DSC or LSC, thereby reducing structural complexity while maintaining Power Integrity benefits. The passive component becomes an intrinsic part of the substrate rather than an add-on element.
Solution Approach 2:
The patent embeds passive components within the core portions of the substrate, creating a nested structure where the passive component is contained inside the substrate body. This nesting approach allows the passive component to be integrated into the substrate's internal structure, reducing the need for external mounting hardware and simplifying the overall board structure while preserving electrical performance.
2Reliability
If an Embedded Passive Substrate (EPS) structure is implemented, then Power Integrity (PI) characteristics are improved, but it becomes difficult to introduce via connections through a build-up process
Solution Approach 1:
The patent performs preliminary actions by pre-forming via holes and embedding passive components within the core portions before the final substrate assembly. This preliminary preparation of via connections and passive component placement simplifies the subsequent build-up process, as the complex tasks are already completed during core portion manufacturing rather than requiring complex post-assembly operations.
Solution Approach 2:
The patent segments the substrate manufacturing process into separate stages: first manufacturing core portions with embedded passive components and pre-formed vias, then assembling multiple core portions together. This segmentation allows via connections to be established within each core portion independently, making the overall EPS implementation more manufacturable compared to attempting to create all via connections in a single complex build-up process.
3Adaptability or versatility
If multiple core portions are bonded vertically using a bonding layer, then design flexibility and electrical connections between passive components are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The bonding layer performs multiple functions simultaneously: it mechanically bonds the core portions together, provides electrical connections between passive components in different core portions through embedded conductive particles, and serves as an insulating barrier where needed. This multi-functionality reduces the need for separate bonding and electrical connection structures, simplifying the overall manufacturing process despite the vertical stacking complexity.
Solution Approach 2:
The bonding layer acts as an intermediary between the core portions, containing conductive particles that facilitate electrical connections between passive components in adjacent core portions. This intermediary structure with conductive particles provides a simplified path for electrical connectivity compared to requiring direct through-vias or complex wire bonds between stacked core portions, thereby reducing manufacturing complexity while enabling design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved Power Integrity (PI) characteristics and increased design flexibility by enabling efficient electrical connections between passive components, thus enhancing the overall performance of the printed circuit board.
Implementation Method 1
a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components
Data Source
AI summary
A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.