Backside Conductor Layout for Heat-Sinked Semiconductor Packaging
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving high heat dissipation performance while maintaining low manufacturing costs, as the use of thick backside conductors for heat sinks leads to deformation and increased costs due to the need for customized molding dies and support pins.
Innovation Solution
The semiconductor device integrates backside conductors with a matrix of cavity structures, using portions of the conductors as both heat sinks and electrodes, and additional support members positioned near dicing lines to prevent deformation during molding, eliminating the need for customized dies and support pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If support pins are provided to the molding die to support the circuit board, then board deformation is prevented, but manufacturing cost increases due to customized molding dies for each product size
Solution Approach 1:
The backside conductor itself serves as the support member during molding, eliminating the need for separate support pins. The conductor's own structure provides the necessary support function, making the system self-sufficient and avoiding additional components that would require customization.
Solution Approach 2:
The backside conductor performs multiple functions: it provides electrical connection, acts as a heat sink, and serves as a support member during molding. This multi-functionality eliminates the need for separate support pins and reduces the need for customized molding dies for different product sizes.
2Ease of manufacture
If support pins with constant height are used, then manufacturing process is simplified, but boards with varying backside conductor thickness cannot be properly supported
Solution Approach 1:
The backside conductor provides support through its own structure rather than relying on externally attached support pins. Since the conductor is an integral part of the board, it automatically adapts to thickness variations without requiring standardized support components.
Solution Approach 2:
The support function is achieved by utilizing the backside conductor's own thickness parameter rather than attempting to compensate for thickness variations with adjustable or standardized support pins. The conductor's inherent structure provides appropriate support regardless of thickness variations.
3Temperature
If thick backside conductors are used for heat sinks, then heat dissipation performance improves, but board deformation occurs during molding due to floating regions
Solution Approach 1:
The backside conductor simultaneously provides heat dissipation and structural support functions. By positioning the conductor to extend toward the dicing lines, it creates a rigid structure that prevents board deformation during molding while maintaining its heat sink capability.
Solution Approach 2:
The backside conductor acts as a composite structural element combining electrical connectivity, thermal management, and mechanical support functions. This integrated approach creates a rigid structure that prevents deformation while maintaining heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high heat dissipation performance with reduced manufacturing costs by preventing board deformation and minimizing the need for additional support structures, thus enhancing yield and reducing production expenses.
Implementation Method 1
a portion of the backside conductors that blocks each of the plurality of openings from the backside functions as a heat sink on which the semiconductor element is mounted
Data Source
AI summary
A backside conductors is configured such that an electrode for electrical connection to an outside is formed in addition to a heat sink in correspondence with each of a plurality of cavity structures, and a support member is formed so as to be at a position separated from dicing lines for dividing each of the cavity structures into an individual piece, arranged closer to the dicing lines than to the heat sink and the electrode, and interposed between a molding die and a board at a time of integral molding with the mold material.