Backside Gate Cut Layout for Lower Nanotransistor Coupling Capacitance
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Solution Overview
Problem
Forming gate terminals with desired characteristics in nanostructure transistors is challenging, leading to difficulties in reducing parasitic capacitance and achieving improved switching speed and reduced power consumption in integrated circuits.
Innovation Solution
A backside gate cutting process is employed to selectively remove portions of the gate cap metal between adjacent gate electrodes, electrically isolating some gate electrodes and reducing parasitic capacitance by minimizing the gate metal between them.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gate terminals are formed in nanostructure transistors to increase computing power, then transistor functionality is improved, but parasitic capacitance increases and switching speed deteriorates
Solution Approach 1:
The gate terminal is segmented into multiple conductive portions separated by dielectric material. This segmentation divides the continuous gate electrode into discrete segments, reducing the parasitic capacitance between adjacent gates while maintaining the necessary electrical connections for transistor operation.
Solution Approach 2:
Conductive portions of the gate terminal are selectively removed or extracted from regions where they would create excessive parasitic capacitance. This extraction eliminates harmful capacitive coupling between adjacent transistors while preserving the gate's essential functionality for controlling current flow.
2Reliability
If gate terminals are formed in nanostructure transistors to increase computing power, then transistor functionality is improved, but power consumption increases
Solution Approach 1:
The gate terminal is segmented into multiple conductive portions separated by dielectric material. This segmentation divides the continuous gate electrode into discrete segments, reducing the parasitic capacitance between adjacent gates while maintaining the necessary electrical connections for transistor operation.
Solution Approach 2:
Conductive portions of the gate terminal are selectively removed or extracted from regions where they would create excessive parasitic capacitance. This extraction eliminates harmful capacitive coupling between adjacent transistors while preserving the gate's essential functionality for controlling current flow.
3Quantity of substance
If gate electrodes are closely spaced to increase transistor density, then computing power is improved, but capacitive coupling between gates increases
Solution Approach 1:
A dielectric material is introduced as an intermediary between adjacent conductive gate portions. This dielectric layer acts as an electrical insulator that prevents direct capacitive coupling between gates while allowing the gates to remain in close proximity, thereby maintaining high transistor density without excessive parasitic capacitance.
Solution Approach 2:
The gate terminal is segmented into multiple conductive portions separated by dielectric material. This segmentation divides the continuous gate electrode into discrete segments, reducing the parasitic capacitance between adjacent gates while maintaining the necessary electrical connections for transistor operation.
Data Source
AI summary
An integrated circuit includes a first nanostructure transistor and a second nanostructure transistor. The first and second nanostructure each include gate electrodes. A backside trench separates the first gate electrode from the second gate electrode. A bulk dielectric material fills the backside trench. A gate cap metal electrically connects the first gate electrode to the second gate electrode.


