Backside Redistribution Heat Pads to Prevent Package Delamination
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Solution Overview
Problem
The challenge in semiconductor packaging is the delamination of the backside enhancement layer due to heat accumulation during laser drilling, which affects the long-term reliability of the package and the oxidation of contact pads, impacting the quality of conductive connectors.
Innovation Solution
Incorporation of dummy pads in the back-side redistribution structure, which are electrically isolated and equipped with metallization patterns to dissipate heat, reducing heat accumulation and preventing delamination, thereby improving package reliability and connector quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser drilling is performed to create through-holes in the backside enhancement layer, then through-holes are successfully formed for electrical connections, but heat accumulation occurs causing delamination of the backside enhancement layer
Solution Approach 1:
Dummy pads are introduced as intermediary heat dissipation structures between the laser drilling process and the backside enhancement layer. These dummy pads absorb and disperse the heat generated during laser drilling, preventing direct heat transfer to the backside enhancement layer that would cause delamination, while still allowing through-holes to be formed in the required locations.
Solution Approach 2:
The harmful heat accumulation effect during laser drilling is converted into a beneficial heat dissipation mechanism by strategically placing dummy pads. The dummy pads act as heat sinks that absorb the excess heat from laser drilling and redirect it through dedicated heat dissipation paths, transforming the harmful thermal effect into a controlled heat management solution.
2Manufacturing precision
If laser drilling is performed to create through-holes, then electrical connections are established, but oxidation of contact pads occurs reducing connector quality
Solution Approach 1:
Dummy pads serve as intermediary structures that intercept and manage the heat generated during laser drilling before it reaches the contact pads. By positioning dummy pads in the heat path, they act as thermal barriers that protect the contact pads from thermal oxidation, thereby preserving connector quality while still enabling through-hole formation for electrical connections.
3Reliability
If dummy pads are added to the back-side redistribution structure for heat dissipation, then heat accumulation is reduced and delamination is prevented, but device complexity increases
Solution Approach 1:
The dummy pads are designed to serve multiple functions simultaneously: they act as heat dissipation structures during laser drilling, provide mechanical support to the backside enhancement layer, and can be integrated into the existing redistribution layer pattern. This multi-functionality reduces the need for separate heat management components, thereby limiting the increase in device complexity while achieving improved reliability.
4Reliability
If dummy pads with metallization patterns are incorporated, then heat dissipation is improved and connector wetting is enhanced, but manufacturing process complexity increases
Solution Approach 1:
The dummy pads are merged with the existing redistribution layer metallization patterns during the same fabrication process steps. The dummy pad metallization is formed using the same deposition and patterning processes as the functional redistribution layers, combining heat dissipation functionality with the existing interconnect structure without requiring separate manufacturing processes, thereby minimizing the increase in manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat-related delamination and oxidation issues, enhancing the long-term reliability and quality of semiconductor packages by improving heat dissipation and wetting of conductive connectors.
Implementation Method 1
equipped with metallization patterns to dissipate heat, reducing heat accumulation and preventing delamination
Implementation Method 2
heat accumulation during laser drilling, which affects the long-term reliability of the package
Implementation Method 3
improve the wetting of the conductive materials on the contact pads during the formation of conductive connectors
Data Source
AI summary
A semiconductor package including one or more heat dissipation systems and a method of forming are provided. The semiconductor package may include one or more integrated circuit dies, an encapsulant surrounding the one or more integrated circuit dies, a redistribution structure over the one or more integrated circuit dies and the encapsulant. The redistribution structure may include one or more heat dissipation systems, which are electrically isolated from remaining portions of the redistribution structure. Each heat dissipation system may include a first metal pad, a second metal pad, and one or more metal vias connecting the first metal pad to the second metal pad.