Bake Plate Projections and Suction for Substrate Curvature Correction

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Solution Overview

Problem

Conventional substrate heat treatment apparatuses face challenges in achieving uniform heat treatment due to substrate curvature caused by thermal contraction and expansion differences, leading to uneven minute spaces between the substrate and bake plate, which complicates optimal temperature control.

Innovation Solution

A substrate heat treatment apparatus with a bake plate featuring projections and a seal unit that creates a negative pressure in the minute space between the substrate and bake plate, using exhaust bores to correct substrate curvature and maintain uniform contact, ensuring consistent heat distribution across the substrate surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the substrate is heated on the bake plate, then the substrate receives heat treatment, but the substrate curvature becomes uneven due to thermal contraction and expansion differences in multilayer films

Engineering Contradiction:
Improveheat treatmentVSAvoidsubstrate curvature
Core Design Contradiction:
TemperatureVSShape

Solution Approach 1:

The patent applies preliminary action by using suction force before and during heating to pre-correct the substrate curvature. The suction unit creates negative pressure in the minute space between the substrate and bake plate, drawing the substrate surface toward the bake plate and correcting curvature caused by thermal effects before uniform heat treatment can occur

Inventive Principle:
Principle #10Preliminary action

2Temperature

If the substrate is separated from the bake plate by a minute space, then the substrate is less affected by temperature variations, but the minute space becomes uneven due to substrate curvature

Engineering Contradiction:
Improvetemperature uniformityVSAvoidminute space uniformity
Core Design Contradiction:
TemperatureVSShape

Solution Approach 1:

The patent applies pneumatics by using a suction unit to create negative pressure in the minute space between the substrate and bake plate. This pneumatic force draws the substrate surface toward the bake plate, correcting curvature and ensuring uniform spacing. The suction force is distributed across the entire substrate surface, maintaining consistent minute space uniformity despite thermal expansion differences in multilayer films

Inventive Principle:
Principle #29Pneumatics and hydraulics

3Temperature

If temperature control is divided into multiple areas, then optimal temperature control for each substrate curvature is possible, but the control system becomes complicated

Engineering Contradiction:
Improvetemperature control precisionVSAvoidcontrol system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies universality by using a single suction unit that performs multiple functions: it corrects substrate curvature, maintains uniform minute space, and enables uniform heat treatment. This multi-functional approach eliminates the need for complex area-divided temperature control systems, as the suction force uniformly addresses curvature issues across the entire substrate surface

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively corrects substrate curvature and achieves uniform heat treatment by maintaining appropriate contact between the substrate and bake plate, enhancing temperature uniformity and preventing contamination during the process.

Implementation Method 1

When gas is exhausted from minute space through the exhaust bores, a negative pressure is produced in the minute space, and the substrate surface is drawn by this negative pressure toward the bake plate

Methodology Applied
Scientific EffectNegative pressure: Pressure Drop

Implementation Method 2

the substrate placed on the bake plate is heat-treated in a state of the gas exhausted from the minute space through the exhaust bores

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7432476B2Substrate heat treatment apparatus
Publication Date: 2008.10.07 SCREEN HOLDINGS CO LTD
  • US7432476B2 patent drawing
  • US7432476B2 patent drawing
  • US7432476B2 patent drawing

AI summary

A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate having projections on an upper surface thereof, a seal unit disposed peripherally of the upper surface of the bake plate for closing a lateral area of a minute space formed between a lower surface of the substrate and the upper surface of the bake plate when the substrate is placed on the bake plate, and exhaust bores for exhausting gas from the minute space. The substrate placed on the bake plate is heat-treated in a state of the gas exhausted from the minute space through the exhaust bores.