Ball Attach Antenna Package to Reduce 5G Substrate Warpage
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Solution Overview
Problem
The integration of antennas in mobile devices faces challenges due to high warpage issues in 5G substrate assemblies, which are exacerbated by imbalanced copper density and thick dielectric layers, leading to increased assembly complexity and reduced manufacturing yield.
Innovation Solution
Decoupling the antenna section from the 5G substrate using a ball attach array (BGA) connection, allowing for separate fabrication and alignment of antenna and base substrates, with copper core solder balls to maintain consistent spacing and RF performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If antennas are integrated into 5G substrate assemblies using traditional lamination methods, then RF performance can be achieved, but substrate warpage increases and manufacturing yield decreases
Solution Approach 1:
The patent divides the antenna assembly into separate components: an antenna substrate containing antenna elements and a base substrate containing RF circuitry. These segmented parts are fabricated independently with controlled copper density and dielectric thickness, then connected via BGA balls to form the complete 5G assembly. This segmentation allows each component to be optimized independently, reducing overall warpage while maintaining RF performance.
2Reliability
If thick dielectric layers are used to isolate antenna layers, then RF isolation is improved, but substrate warpage is exacerbated
Solution Approach 1:
The patent applies different dielectric thicknesses to different regions of the antenna substrate. Thick dielectric layers are used specifically in areas where RF isolation between antenna elements is critical, while thinner dielectric layers are used in other regions to minimize overall substrate warpage. This localized approach to dielectric thickness optimization allows the design to achieve adequate RF isolation without the penalty of uniformly thick dielectric layers across the entire substrate.
3Adaptability or versatility
If imbalanced copper density is present in substrate layers, then antenna design flexibility is improved, but substrate warpage increases
Solution Approach 1:
The patent separates the antenna substrate from the base substrate, allowing each to have independent copper layer configurations. The antenna substrate can have imbalanced copper density optimized for specific antenna designs without affecting the overall assembly warpage, as the base substrate provides structural support. This segmentation enables design flexibility while maintaining manufacturing precision through proper copper balancing in the combined structure.
4Area of stationary object
If antennas and RF circuitry are integrated in the same substrate, then device area is reduced, but assembly complexity increases
Solution Approach 1:
The patent uses a modular segmented architecture where antenna elements and RF circuitry are fabricated on separate substrates that are then connected through BGA ball arrays. This segmentation enables independent fabrication and testing of each module, simplifying the overall assembly process compared to monolithic integration. The standardized BGA connection interface further reduces assembly complexity by providing a repeatable, automated joining method.
Solution Approach 2:
The BGA ball array serves as an intermediary connection mechanism between the antenna substrate and base substrate. This intermediary provides both electrical connectivity and mechanical support, simplifying the integration process. The BGA balls act as a standardized interface that enables automated assembly and reduces the complexity of directly integrating antenna elements with RF circuitry on the same substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces substrate warpage, simplifies packaging design, enhances manufacturing yield, and allows for flexible antenna design upgrades without re-designing the entire substrate, while maintaining consistent RF performance.
Implementation Method 1
bonding a bottom surface of the antenna package to a top surface of the base package
Data Source
AI summary
In accordance with disclosed embodiments, there is an antenna package using a ball attach array to connect an antenna and base substrates of the package. One example is an RF module package including an RF antenna package having a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces, a base package having alternating patterned conductive and dielectric layers to form routing through the base package, and a bond between a bottom surface of the antenna package and to a top surface of the base package.