High-Frequency Module Circuit Layout for Harmonic Coupling Suppression
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Solution Overview
Problem
Existing high frequency modules face signal interference issues when transmitting and receiving signals of different bands due to harmonic overlap, particularly in carrier aggregation systems, where harmonics from low band transmission signals can interfere with high band reception signals.
Innovation Solution
The high frequency module incorporates a configuration where band processing circuits are arranged on separate substrates and strategically positioned to increase distance and reduce electromagnetic and electrostatic coupling, with unused band processing circuits acting as intermediaries between active circuits to suppress harmonic interference. This includes using first, second, third, and fourth band processing circuits, each with transmission and reception filters, and amplification circuits, to isolate frequency bands and prevent harmonic overlap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If band processing circuits are disposed close together on the substrate to reduce device size, then device integration is improved, but signal interference between bands increases due to electromagnetic and electrostatic coupling
Solution Approach 1:
The patent introduces a ground circuit as an intermediary element disposed between band processing circuits that handle different frequency bands. This ground circuit acts as a shield to reduce electromagnetic and electrostatic coupling between adjacent circuits, thereby suppressing signal interference while allowing compact arrangement of components on the substrate.
Solution Approach 2:
The patent segments the substrate into multiple regions with different ground potential levels, creating isolated electromagnetic environments for different band processing circuits. By dividing the ground structure into separate potential zones, the patent reduces cross-band interference while maintaining compact device dimensions.
2Reliability
If filters are added to suppress harmonic interference, then signal quality is improved, but device complexity increases
Solution Approach 1:
The ground circuit serves as a passive intermediary that suppresses harmonic interference through electromagnetic shielding without requiring active filtering components. This approach improves signal quality by blocking harmonic frequencies while avoiding the complexity of additional filter circuits.
Solution Approach 2:
The patent converts the potentially harmful electromagnetic coupling between circuits into a beneficial shielding effect by strategically placing ground circuits. The ground circuits absorb and redirect electromagnetic energy, transforming what would be interference into a protective mechanism that suppresses harmonics without adding complex filtering hardware.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses signal interference between different frequency bands, allowing for simultaneous transmission and reception of multiple bands while minimizing harmonic interference, thereby enhancing communication device performance and efficiency.
Implementation Method 1
a first transmission filter configured to filter a signal of a first frequency band and output the filtered signal as a first transmission signal
Implementation Method 2
a second transmission filter configured to filter a signal of a second frequency band, which is a signal of a different frequency band from the first frequency band, and output the filtered signal as a second transmission signal, or a second reception filter configured to filter a signal of the second frequency band and output the filtered signal as a second reception signal
Implementation Method 3
a third reception filter configured to filter a signal of a third frequency band, which is a signal of a different frequency band from the first frequency band and the second frequency band, and output the filtered signal as a third reception signal
Implementation Method 4
the second band processing circuit is disposed between the first band processing circuit and the third band processing circuit in a plan view to reduce electromagnetic and electrostatic coupling
Implementation Method 5
the second band processing circuit is disposed between the first band processing circuit and the third band processing circuit in a plan view to reduce electromagnetic and electrostatic coupling
Data Source
AI summary
In a high frequency module, a first band processing circuit, a second band processing circuit, and a third band processing circuit. The first band processing circuit is used at the same time as the third band processing circuit (D3) when wireless communication is performed. A frequency of a harmonic of a first transmission signal of the first band processing circuit is included in a frequency band of a third reception signal of the third band processing circuit. The second band processing circuit is not used at the same time as the first band processing circuit and the third band processing circuit (D3) when wireless communication is performed and is disposed between the first band processing circuit and the third band processing circuit in a plan view of the substrate.