Bar Vias for PCB Electromagnetic Shielding
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Solution Overview
Problem
Printed circuit boards face challenges in carrying high-frequency signals without electromagnetic interference and excessive radiation, which can interfere with other electronic equipment and pose security risks.
Innovation Solution
The implementation of a shielding conductive bar via that surrounds signal-carrying vias in a stacked arrangement of conductor and nonconducting layers, forming an electromagnetic shell to prevent interference and radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If simple conductive traces are used to carry high frequency signals, then the functionality and capacity of PCBs can be increased, but electromagnetic interference and excessive radiation occur
Solution Approach 1:
The shielding structure is segmented into multiple individual bar vias arranged in a specific pattern around each signal-carrying via. Rather than using a continuous shield, the solution divides the shielding function into discrete elements (bar vias) that can be precisely positioned to target specific interference sources while minimizing overall electromagnetic impact.
Solution Approach 2:
The shielding is applied locally around specific signal-carrying vias that require protection, rather than implementing universal shielding across the entire PCB. The bar vias are positioned in spaced-apart relations at specific locations (such as north, south, east, and west directions) to provide targeted electromagnetic shielding only where high-frequency signals are present and interference is a concern.
2Object-generated harmful factors
If shielding structures are added to reduce electromagnetic interference, then radiation and interference are reduced, but device complexity increases
Solution Approach 1:
Instead of adding continuous ground planes or extensive shielding layers that would significantly increase complexity, the invention inverts the approach by using minimal discrete bar vias that leverage the existing via structure. The shielding is achieved by strategically placing non-electrically-coupled bar vias around signal vias, essentially using the via formation process itself to create both signal and shielding functions without adding substantial structural complexity.
Solution Approach 2:
The bar vias are formed using the same via formation process as the signal-carrying vias, allowing them to be created simultaneously during PCB manufacturing. This self-service approach means the shielding structure utilizes the existing manufacturing capabilities and material deposition processes, avoiding the need for separate shielding fabrication steps and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively shields individual signal-carrying structures on printed circuit boards, reducing electromagnetic interference and radiation, allowing for precise control and security enhancements.
Implementation Method 1
A shielding conductive via is formed in the first nonconducting layer, is not electrically coupled to the signal carrying conductive via, and substantially completely surrounds the signal carrying conductive via in spaced apart relation thereto
Data Source
AI summary
An electronic device disclosed herein includes a first conductor layer, a first nonconducting layer, and a second conductor layer in a stacked arrangement. A signal carrying conductive via is formed in the first nonconducting layer and extends between the first conductor layer and the second conductor layer. A shielding conductive via is formed in the first nonconducting layer, is not electrically coupled to the signal carrying conductive via, and substantially completely surrounds the signal carrying conductive via in spaced apart relation thereto.