Base Panel-Free Cooler Module for Semiconductor Heat Dissipation
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Solution Overview
Problem
Conventional cooler modules with a base panel are costly, heavy, and inefficient due to material differences between heat pipes and the base panel, leading to slow heat dissipation and non-environmentally friendly bonding processes.
Innovation Solution
A cooler module design that eliminates the base panel by using radiation fins and heat pipes with a flat bottom surface for direct bonding to semiconductor devices, where heat pipes are U-pipes with one or both ends fastened to the fins, and the fins are arranged in a stack with notches for press-fitting, reducing material costs and enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a base panel is used in the conventional cooler module, then the heat transfer medium function is provided, but the size and weight of the heat sink increase significantly
Solution Approach 1:
The patent removes the base panel from the conventional cooler module structure. The heat pipes are directly fastened to the radiation fins without requiring a base panel, thereby eliminating unnecessary material while maintaining the heat transfer function through the heat pipes themselves.
Solution Approach 2:
The cooler module is segmented into independent components where heat pipes serve dual purposes: as structural elements fastening radiation fins and as heat transfer medium. This segmentation eliminates the need for a separate base panel, reducing overall weight and material usage.
2Ease of manufacture
If heat pipes are plated with nickel before bonding to the base panel, then the bonding compatibility is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent eliminates the base panel from the structure, thereby removing the entire bonding process between heat pipes and base panel. This extraction of the base panel component eliminates the need for nickel plating and complex bonding procedures.
3Adaptability or versatility
If different materials are used for heat pipes and base panel, then the material properties are optimized, but the bonding process becomes non-environmentally friendly and costly
Solution Approach 1:
By removing the base panel from the structure, the patent eliminates the material incompatibility issue between heat pipes and base panel. The heat pipes are directly fastened to radiation fins, bypassing the need for environmentally problematic bonding processes.
4Temperature
If the thermal conductivity of heat pipes is much higher than base panel and radiation fins, then the heat dissipation speed should be improved, but the conventional structure cannot quickly dissipate heat at the beginning
Solution Approach 1:
The patent restructures the heat dissipation path by segmenting out the base panel, allowing heat pipes with high thermal conductivity to directly contact the heat source and transfer heat to radiation fins. This creates an optimized heat flow path that leverages the superior thermal conductivity of heat pipes from the start.
Solution Approach 2:
Instead of having heat flow from base panel to heat pipes to radiation fins, the patent inverts the structure so heat flows directly from the heat source through heat pipes to radiation fins, utilizing the high thermal conductivity of heat pipes as the primary heat transfer path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the size and weight of the cooler module, saves material costs, and improves heat dissipation efficiency by eliminating the need for a solid metal base panel and using high thermal conductivity heat pipes for direct heat transfer from semiconductor devices to radiation fins.
Implementation Method 1
Each heat pipe has a flat bottom surface portion exposed to the outside of the radiation fins for bonding to a semiconductor device to transport heat from the semiconductor device to the radiation fins for quick dissipation
Implementation Method 2
The heat pipes are sealed hollow U-pipes filled with a working fluid
Implementation Method 3
The radiation fins are extruded from aluminum or copper
Implementation Method 4
The base panel is made out of copper or aluminum, and adapted for transporting heat from, for example, a semiconductor chip to the radiation fins for quick dissipation into the outside open air
Implementation Method 5
The heat pipes are sealed hollow U-pipes filled with a working fluid
Data Source
AI summary
A light, compact, non-bottom panel type cooler module includes a plurality of radiation fins arranged in a stack, and a plurality of U-shaped heat pipes fastened to the radiation fins to hold the radiation fins in parallel, each U-shaped heat pipe having one or two opposite end pipe sections thereof press-fitted into respective through holes on the radiation fins and a flat bottom surface portion exposed to the outside of the radiation fins for bonding to a semiconductor device for enabling the heat pipes to transport heat from the semiconductor device to the radiation fins for dissipation.