Bulk Acoustic Wave Filter Housing With Integrated Passive Elements
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Solution Overview
Problem
The existing bulk acoustic wave filters are limited by their size and unit price, which hinders the reduction of overall high-frequency component size and cost in wireless mobile communications technology.
Innovation Solution
The design incorporates a substrate, piezoelectric layer, electrodes, and passive elements within a housing structure, where passive elements like capacitors and inductors are strategically placed to occupy margin space, reducing the overall size and unit price by optimizing the electrical path and design freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If passive elements are integrated within the housing structure, then the overall size is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent merges the passive elements (capacitors and inductors) with the housing structure by disposing them on the inner surface of the housing. This integration eliminates the need for separate mounting spaces and connection structures, thereby reducing the overall device size while managing manufacturing complexity through a unified design approach.
Solution Approach 2:
The passive elements are disposed on the inner surface of the housing rather than being mounted on the substrate plane. This three-dimensional arrangement utilizes the vertical space within the housing, reducing the footprint on the substrate and thereby reducing the overall device size without significantly increasing manufacturing complexity.
2Adaptability or versatility
If passive elements are disposed on the inner surface of the housing, then design freedom is enhanced, but the manufacturing precision requirements increase
Solution Approach 1:
The housing structure serves multiple functions: it provides mechanical protection, defines the device boundary, and acts as a mounting substrate for passive elements. This multi-functionality enhances design freedom by allowing flexible placement of passive elements on the inner surface without requiring additional dedicated mounting structures.
Solution Approach 2:
The passive elements are disposed on the inner surface of the housing during the housing fabrication process itself, rather than being mounted subsequently. This preliminary integration simplifies the overall manufacturing process and reduces the cumulative precision requirements that would arise from multiple separate assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the size and unit price of the bulk acoustic wave filter while maintaining high-frequency signal filtering efficiency, enhancing design flexibility and reducing electromagnetic interference.
Implementation Method 1
a piezoelectric layer including a piezoelectric material, the piezoelectric layer disposed between the first and second electrodes
Data Source
AI summary
A bulk acoustic wave filter includes a substrate, a first electrode and a second electrode disposed on the substrate, a piezoelectric layer including a piezoelectric material, the piezoelectric layer disposed between the first and second electrodes, and a passive element disposed on one surface of a housing. The housing is coupled to the substrate to accommodate the piezoelectric layer, the first electrode and the second electrode.