BBUL Package Substrate Embedded Dice Direct Bus Connection
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Solution Overview
Problem
In stacked die semiconductor configurations, connector pathways passing through dice can occupy valuable space and cause electrical interference, limiting power transmission and efficiency due to the geometry constraints of known manufacturing methods.
Innovation Solution
The implementation of a bumpless build-up layer (BBUL) package substrate with embedded dice, where each die connects directly to the substrate without using through-silicon vias (TSVs), allowing for a larger footprint of secondary dice to facilitate connections outside the primary die's periphery, enabling cost savings and separation of functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connector pathways pass through dice to transmit data or power, then connections between dice are established, but valuable space is occupied and electrical interference occurs
Solution Approach 1:
The patent transitions from planar connections to three-dimensional stacked connections. Multiple dice are arranged vertically in stacks, with connections made through vertical pathways (TSVs) rather than horizontal routing. This dimensional change allows higher connection density without increasing the lateral footprint of individual dice, resolving the space occupation problem while maintaining connection reliability.
Solution Approach 2:
The patent introduces an intermediary substrate layer that facilitates connections between dice. The substrate provides a platform for vertical interconnections and allows signals to be routed between stacked dice without requiring direct through-die pathways, reducing electrical interference while maintaining reliable connections.
2Productivity
If through-silicon vias (TSVs) are used to connect dice, then vertical connections are achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent segments the interconnection function across multiple layers: TSVs provide vertical connectivity within dice stacks, while the substrate provides additional routing capacity. This segmentation allows each component to be optimized independently, reducing the overall manufacturing complexity compared to requiring all connections to be made through TSVs alone.
Solution Approach 2:
The substrate acts as an intermediary that simplifies manufacturing by providing a flexible routing platform. Rather than requiring complex direct TSV connections for all signal paths, the substrate mediates connections, allowing for easier manufacturing and repair while maintaining high stacking efficiency.
3Area of stationary object
If dice are arranged in stacked configuration, then space utilization is improved, but electrical interference and power transmission limits occur
Solution Approach 1:
The patent uses three-dimensional stacking to achieve high space utilization while managing power and signal transmission. By distributing connections across multiple vertical layers and using the substrate for additional routing, the design reduces congestion and interference that would otherwise limit power transmission in tightly packed stacked configurations.
Solution Approach 2:
The patent segments power and signal pathways across different substrate layers and dice interfaces. This segmentation separates power transmission paths from data signal paths, reducing electrical interference and improving power transmission efficiency while maintaining compact stacked packaging.
Data Source
AI summary
This disclosure relates generally to package substrates with multiple embedded dice wherein each of the embedded dice can be connected directly to a bus of the package substrate without being routed through another die. The package substrate may be configured as a bumpless build up layer (BBUL) substrate.