BCC Sputtering Target Processing for Uniform {111} Orientation
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Solution Overview
Problem
Existing methods for producing metals with a body-centered cubic structure as sputtering targets result in insufficient orientation in the {111} plane, leading to non-uniform deformation and low deposition efficiency.
Innovation Solution
A metal material with a body-centered cubic structure is produced by a pressurization treatment at 500°C or higher and a pressurizing rate of less than 15 mm/s, followed by a heat treatment at 850°C or higher, to achieve an orientation area fraction ratio of the {111} plane of 0.45 or more, with specific grain size and impurity controls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If repeated forging and rolling treatments are used to orient the metal in the {111} plane, then the deposition efficiency is improved, but the orientation becomes non-uniform and surface deformation occurs
Solution Approach 1:
The invention changes the parameters of the pressurization treatment, specifically setting the temperature to 500°C or higher and the pressurizing rate to less than 15 mm/s. These parameter changes enable achieving a {111} plane orientation ratio of 0.45 or more while maintaining uniform orientation throughout the material, resolving the contradiction between improving deposition efficiency and maintaining orientation uniformity.
Solution Approach 2:
The invention performs preliminary heating to 500°C or higher before pressurization treatment. This preliminary action prepares the material by increasing its temperature to a range where pressurization can be applied more uniformly, preventing surface deformation and ensuring uniform orientation throughout the material while still achieving high deposition efficiency.
2Loss of time
If high pressurizing rate is used to increase production speed, then the manufacturing time is reduced, but the orientation uniformity and material quality deteriorate
Solution Approach 1:
The invention optimizes the pressurizing rate parameter by setting it to less than 15 mm/s. This parameter change ensures that pressure is applied uniformly throughout the material, preventing non-uniform orientation and surface deformation. The controlled rate maintains manufacturing precision while the overall process remains efficient.
Solution Approach 2:
The invention performs preliminary heating to 500°C or higher before pressurization. This preliminary action prepares the material to better withstand and uniformly distribute the pressurization force, allowing for controlled pressurizing rates that maintain orientation uniformity without excessive manufacturing time.
3Device complexity
If conventional pressurization treatment is used, then the process is simple, but the {111} plane orientation ratio is insufficient
Solution Approach 1:
The invention achieves high {111} plane orientation ratio (0.45 or more) by changing the parameters of pressurization treatment to temperature of 500°C or higher and pressurizing rate of less than 15 mm/s. These parameter changes improve orientation precision while maintaining relatively simple processing steps, thus resolving the contradiction between process complexity and orientation ratio.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the orientation of the {111} plane, improving deposition efficiency and uniformity, reducing strain and particle generation, and ensuring high purity and uniform film formation.
Implementation Method 1
a pressurization step of performing a pressurization treatment on an ingot formed of a metal having a body-centered cubic structure at a pressurizing temperature of 500° C. or higher and a pressurizing rate of less than 15 mm/s
Implementation Method 2
performing a pressurization treatment on an ingot formed of a metal having a body-centered cubic structure at a pressurizing temperature of 500° C. or higher
Implementation Method 3
a heat treatment step of treating the processed ingot at 850° C. or higher
Implementation Method 4
When a metal having a body-centered cubic structure is used as a sputtering target, sputtered particles deposit in the {111} plane direction
Data Source
AI summary
A metal material includes a metal having a body-centered cubic structure, in which with respect to a sum of orientation area fractions of a {001} plane, a {101} plane and a {111} plane, a ratio of the orientation area fraction of the {111} plane is 0.45 or more.