Beam Columnar Body Plug Structure for NAND Flash Collapse Prevention
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Solution Overview
Problem
Current semiconductor memory devices, particularly NAND type flash memory, face challenges in maintaining mechanical strength and structural integrity due to the two-dimensional contact between core and cap insulating films, leading to potential collapse during manufacturing processes.
Innovation Solution
The implementation of a semiconductor memory device with a beam columnar body featuring a cap semiconductor film with a plug portion buried in the core insulating film, providing enhanced mechanical strength and bonding, and allowing for parallel batch formation with memory columnar bodies without increasing processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a two-dimensional contact structure between core and cap insulating films is used, then the manufacturing process is simple, but the mechanical strength is insufficient leading to potential collapse
Solution Approach 1:
The patent transitions from a two-dimensional contact structure to a three-dimensional structure by forming a plug portion that extends vertically into the core insulating film. This dimensional change provides enhanced mechanical interlocking and bonding strength between the cap insulating film and the core insulating film, preventing collapse during manufacturing processes while maintaining structural integrity.
Solution Approach 2:
The plug portion is embedded within the core insulating film, creating a nested structure where the cap insulating film contains the plug portion which in turn contacts the core insulating film. This nested configuration enhances mechanical strength through internal support while maintaining a compact overall structure.
2Strength
If a beam columnar body with plug portion is implemented, then mechanical strength is enhanced, but device complexity increases
Solution Approach 1:
The patent combines the formation of the plug portion with the existing memory columnar body fabrication process. The plug portion is formed as an integrated part of the beam columnar body structure during the same manufacturing steps, merging the mechanical support function with the memory storage function in a single unified structure.
Solution Approach 2:
The plug portion serves multiple functions: it provides mechanical strength to prevent collapse, acts as a bonding interface between insulating films, and maintains structural integrity during processing. This multi-functionality allows the same structural element to address multiple requirements without adding separate components.
Data Source
AI summary
A semiconductor memory device according to an embodiment comprises: conductive layers stacked in a vertical direction on a semiconductor substrate; and first and columnar bodies that extend in the vertical direction, the first and second columnar bodies each comprising: a first film; a second film disposed on the first film; and a semiconductor film, and the first film of the second columnar body having an upper end positioned higher than a first position lower than a first conductive layer and lower than a second position higher than the first conductive layer and a lower end positioned at or lower than the first position, and the second film of the second columnar body having an upper end positioned higher than the second position and a lower end positioned lower than the first position.