Particle Beam Profile Analysis for Analytic Equipment Configuration
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Solution Overview
Problem
Existing techniques for configuring analytic equipment such as scanning electron microscopes and focused ion beam instruments are time-consuming and prone to errors, relying on 2-D images and human assessment, which hinders rapid, consistent, and automated workflows.
Innovation Solution
The implementation of an apparatus and method that collects beam current profiles over a transverse scan to evaluate geometric parameters, allowing for automatic configuration of particle beam machines, using a particle beam source, computer-readable media, and hardware processors to determine longitudinal coordinates and adjust settings for optimal beam performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If existing techniques using 2-D images and human assessment are used to configure analytic equipment, then configuration can be performed with simple equipment, but the process becomes time-consuming and error-prone
Solution Approach 1:
The patent replaces manual visual assessment of 2-D images with an automated image processing system that analyzes beam profiles and calculates geometric parameters. The hardware processor automatically determines waist position, size, and astigmatism by processing transverse beam profiles, eliminating human subjectivity and significantly improving both configuration speed and accuracy.
Solution Approach 2:
The system performs self-configuration by automatically analyzing beam profiles and adjusting equipment parameters without requiring manual intervention. The automated calculation of geometric parameters and generation of configuration settings enables the equipment to configure itself, improving productivity while maintaining high reliability through consistent algorithmic processing.
2Productivity
If automated configuration using beam profile analysis is implemented, then configuration speed and accuracy are improved, but device complexity increases
Solution Approach 1:
The image processing system serves multiple functions: it captures beam profiles, calculates geometric parameters (waist position, size, astigmatism), and generates configuration settings. This multi-functionality consolidates what would otherwise require separate systems into a single integrated apparatus, improving productivity while limiting the increase in device complexity.
Solution Approach 2:
The patent introduces an image processing system as an intermediary between the beam generation equipment and the configuration control system. This intermediary automatically translates raw beam profile data into meaningful geometric parameters and configuration settings, enabling automated configuration while keeping the overall system architecture manageable through clear functional separation.
3Measurement precision
If multiple transverse profiles are evaluated to determine geometric parameters, then measurement precision is improved, but loss of time increases
Solution Approach 1:
The system continuously captures and processes multiple transverse beam profiles in succession, evaluating geometric parameters across all profiles to determine final values. This continuous measurement approach improves precision by averaging out variations while the automated processing minimizes the time penalty, making the enhanced measurement process efficient.
Solution Approach 2:
The patent performs preliminary evaluation of beam profiles to identify trends and variations before final parameter determination. By pre-processing the data to identify key features and variations across multiple profiles, the system can quickly compute accurate geometric parameters, improving measurement precision while reducing the overall time required for complete analysis.
Data Source
AI summary
Beam intercept profiles are measured as a particle beam transversely scans across a probe. A current of beam particles, a detector intensity, or image pixel intensities can variously be measured to obtain the profiles. Multiple profiles are used to determine geometric parameters which in turn can be used to configure equipment. In one application, transverse beam intercept profiles are measured for different waist heights of the particle beam. Steepness of the several profiles can be used to determine a height of the probe as the height at which the profile is steepest. The known probe height enables placing the probe in contact with a substrate at another known height. In another application, transverse beam intercept profiles of orthogonal probe edges are used to position a beam waist, reduce spot size, or reduce astigmatism. Techniques are applicable to SEM, FIB, and nanoprobe systems. Methods and apparatus are disclosed, with variations.