Charged-particle beam writing apparatus thermal deformation compensation
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Solution Overview
Problem
The challenge in charged-particle beam writing apparatuses is the reduction in global positional accuracy due to thermal deformation of the writing object caused by heat sources within the writing chamber, which current heat removal methods, such as water cooling and thermal shields, cannot completely mitigate.
Innovation Solution
A charged-particle beam writing apparatus that includes a temperature distribution calculator, a deformed amount calculator, and a position corrector to accurately calculate and correct for the thermal deformation of the writing object by adjusting the irradiation position of the charged particle beam based on the calculated temperature distribution and constraint conditions, thereby improving positional accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat removal measures such as water cooling and thermal shields are implemented, then thermal deformation is reduced, but it is impossible to completely block thermal flow due to thermal radiation from heat sources
Solution Approach 1:
The system calculates the temperature distribution and deformation amount in advance based on stage movement history information before actual writing occurs. This preliminary calculation allows the system to predict thermal deformation and compensate for it proactively, rather than attempting to prevent thermal radiation physically.
Solution Approach 2:
The system uses calculated temperature distribution and deformation amount as feedback to correct the irradiation position. The position corrector adjusts the beam irradiation position based on the calculated deformation, creating a closed-loop system that compensates for thermal effects in real-time.
2Manufacturing precision
If thermal deformation is not corrected, then the writing process is simple, but global positional accuracy is reduced
Solution Approach 1:
The system replaces physical thermal management mechanisms (such as complex cooling systems and thermal shields) with a computational approach. By using temperature distribution calculation and deformation calculation based on stage movement history, the system substitutes mechanical thermal control with information processing and mathematical modeling.
Solution Approach 2:
The system changes the approach from controlling physical temperature parameters to correcting positional parameters. Instead of attempting to maintain constant temperature through complex thermal management, the system calculates temperature distribution and uses the resulting deformation information to adjust the irradiation position parameters.
3Productivity
If stage movement is continuous, then writing efficiency is maintained, but thermal deformation varies dynamically making correction difficult
Solution Approach 1:
The system performs temperature distribution calculation and deformation calculation in advance based on the stage movement history information. By calculating the thermal effects before actual writing, the system can account for dynamic thermal deformation without interrupting the writing process, thus maintaining productivity while ensuring precision.
Solution Approach 2:
The system dynamically adapts to changing thermal conditions by using stage movement history information to calculate temperature distribution and deformation. The position correction is updated based on the calculated deformation amount, allowing the system to handle dynamic thermal effects during continuous writing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively enhances the global positional accuracy of the electron-beam writing process by accurately accounting for thermal deformation, ensuring precise beam irradiation and improved pattern transfer accuracy.
Implementation Method 1
it is impossible to completely block thermal flow into the writing object due to thermal radiation from those heat sources
Implementation Method 2
The thermal flow causes thermal deformation of the writing object during writing to reduce the global positional accuracy
Data Source
AI summary
A charged-particle beam writing apparatus includes a writing chamber to house a stage having a writing object placed thereon, a beam irradiator to irradiate a charged particle beam to the writing object placed on the stage, a stage driver to move the stage, a temperature distribution calculator to calculate temperature distribution of the writing object caused by a heat source in the writing chamber, based on movement history information of the stage, a deformed amount calculator to calculate a deformed amount of the writing object based on a constraint condition of the writing object placed on the stage and the calculated temperature distribution, and a position corrector to correct an irradiation position of the charged particle beam to the writing object based on the calculated deformed amount. The beam irradiator irradiates the charged particle beam based on the irradiation position corrected by the position corrector.