Bending Photonic Sensor Chips Using Radially Varying Curvature Molds
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Solution Overview
Problem
Optical systems face design constraints when using flat photonic sensor chips, particularly in achieving uniform light intensity and spatial frequency response, due to limitations in lens configuration and aberration tolerances.
Innovation Solution
A photonic sensor chip is bent into a curved shape using a mold with radially varying curvature, allowing for sharper bending at the active sensor region while minimizing stress in the inactive regions, thereby matching desired optical designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a uniform curvature mold is used to bend the photonic sensor chip, then the entire chip is curved uniformly, but high bending stress occurs at the outermost regions causing the chip to break
Solution Approach 1:
The mold has different curvature radii in different radial regions: a first curvature radius for the active sensor region and a second curvature radius (larger than the first) for the inactive outermost region. This local differentiation allows sharp bending where needed while reducing stress at the edges, preventing chip breakage.
2Manufacturing precision
If the entire photonic sensor chip is bent to high curvature, then the active sensor region achieves desired optical shape, but the inactive outermost regions experience excessive stress and break
Solution Approach 1:
The mold applies high curvature (first curvature radius) specifically to the active sensor region to achieve precise optical shaping, while applying lower curvature (second curvature radius) to the inactive outermost regions to minimize bending stress and prevent breakage.
3Ease of manufacture
If a flat photonic sensor chip is used, then manufacturing is simpler, but optical performance is limited due to lens configuration constraints and aberration tolerances
Solution Approach 1:
The photonic sensor chip is transformed from a flat configuration to a curved configuration using a mold with specific curvature radii. This curvature enables the chip to achieve uniform light intensity and spatial frequency response, improving optical system performance while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of high-performance optical systems with uniform light intensity and spatial frequency response across the photonic sensor chip, reducing stress and increasing deflection capabilities without breaking, compared to uniform curvature molds.
Implementation Method 1
A force may be applied to the photonic sensor chip to bend the photonic sensor chip into the shape of the mold. Using a mold having a radially varying curvature may reduce stress during bending at the outermost (non-photoactive) regions of the photonic sensor chip.
Data Source
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AI summary
Techniques for fabricating a semiconductor chip having a curved surface include placing a substantially flat photonic sensor chip on a recessed surface of a mold such that an active region of the photonic sensor chip at least partially covers a concave central region of the mold and an inactive region of the photonic sensor chip at least partially covers a convex peripheral region of the mold. The mold has a radially varying curvature and the recessed surface includes the concave central region and the convex peripheral region concentrically surrounding the concave central region. Pressure may be applied on the photonic sensor chip to press and bend the photonic sensor chip into the mold.