A dual photosensitive image sensor integrates a wire grid polarizer on one region to reject reflected glare while maintaining high sensitivity.
A folded tape package uses a flexible substrate to stack dies and passive components in a compact parallel configuration.
A radiation detector uses filter layer structures to absorb specific wavelengths for tailored spectral sensitivity.
A UBM electrode structure with enhanced Pt adhesion on CdTe substrates prevents peeling during solder bonding.