Folded Tape Package for Electronic Devices Reducing Warpage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic device packaging technologies face challenges in minimizing device size, reducing substrate warpage, and increasing yield, particularly in camera modules, due to the complexity of signal routing and component stacking.
Innovation Solution
A folded tape package using a flexible tape substrate with two end sections and a middle section, where the end sections are folded parallel to the middle section to encapsulate dies and passive components, eliminating the need for through-silicon vias and reducing substrate thickness, thereby minimizing device footprint and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional rigid substrates are used for mounting multiple components, then component stacking is possible, but substrate warpage increases and device footprint increases
Solution Approach 1:
The patent employs a flexible tape substrate that can be folded to accommodate multiple components in a compact arrangement. The flexible nature of the substrate allows it to conform to the stacked component layout without experiencing the warpage issues associated with rigid substrates, while maintaining a small device footprint
Solution Approach 2:
The patent transitions from a planar two-dimensional substrate layout to a three-dimensional folded structure. By folding the flexible substrate, components are arranged in multiple layers vertically, reducing the horizontal footprint while maintaining reliable electrical connections without substrate warpage
2Reliability
If through-silicon vias are used for signal routing in stacked dies, then electrical connections between layers are achieved, but manufacturing complexity and processing time increase
Solution Approach 1:
The patent extracts and eliminates the need for through-silicon vias by using the flexible substrate itself as the interconnection medium. The substrate's inherent flexibility and conductive properties provide the necessary electrical connections between stacked components without requiring additional via formation processes, thereby reducing manufacturing complexity and processing time
Solution Approach 2:
The flexible substrate serves multiple functions simultaneously: it provides mechanical support, enables signal routing between layers, and facilitates thermal management. This multi-functionality replaces the need for separate through-silicon via structures, simplifying the manufacturing process while maintaining reliable electrical connections
3Length of moving object
If substrate thickness is reduced to minimize device size, then device footprint decreases, but manufacturing precision and yield become more difficult to maintain
Solution Approach 1:
The patent utilizes a flexible tape substrate that can be manufactured at reduced thickness while maintaining structural integrity through its inherent flexibility. The flexible nature allows the thin substrate to accommodate manufacturing tolerances better than rigid thin substrates, maintaining yield and manufacturing precision despite the reduced thickness necessary for compact device footprint
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Described herein is a folded tape package for electronic devices. The folded tape package uses a flexible tape substrate having two end sections for passive components and a middle section for connecting and stacking multiple dies. The stacked dies are encapsulated or covered with a mold. One side may be left exposed for device functionality and operation with additional components or devices. The passive components may also be covered with a mold. The end sections are folded such that the end sections are in a parallel configuration with the middle section. The flexible tape substrate may be a high density interconnect flexible tape substrate with two layers. A silicon substrate may be used to interconnect a die stack to the flexible tape substrate. The folded tape package has a reduced device footprint, lower substrate warpage effects, and higher substrate yields.