Electronic Component Asymmetric Recess for Size Reduction
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Solution Overview
Problem
Existing electronic components fail to achieve sufficient size reduction due to limitations in design and manufacturing processes.
Innovation Solution
The design incorporates a support member with a recessed area that allows a substrate with a photoelectric conversion element to be positioned such that the opening width is narrower at the bottom and wider at the top, with a resin member between the device unit and the recess, preventing resin leakage and allowing for a more compact configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional recess structure with uniform opening width is used, then the device can be manufactured with simpler processes, but the electronic component cannot achieve sufficient size reduction
Solution Approach 1:
The recess part is designed with an asymmetric width profile: the opening width at the bottom (near the photoelectric conversion element) is narrower than the width of the device unit, while the opening width at the top (opposite side) is wider than the device unit width. This asymmetric configuration allows the device unit to be securely held while reducing the overall footprint and preventing resin infiltration from above, thereby achieving size reduction without excessive complexity.
2Volume of moving object
If the opening width of the recess part is made narrower to reduce size, then the electronic component achieves better size reduction, but resin may infiltrate between the device unit and the recess part
Solution Approach 1:
The asymmetric width profile of the recess part prevents resin infiltration while maintaining compact size. The narrower bottom opening (wider than device unit width) acts as a barrier to resin flow from below, and the wider top opening (narrower than device unit width) prevents resin from above from reaching the device unit, thus eliminating the harmful effect of resin infiltration.
Solution Approach 2:
The recess structure is designed in advance to prevent resin infiltration before it can occur. By configuring the opening widths such that the bottom opening is narrower and the top opening is wider, the structure proactively blocks resin flow paths, preventing the harmful effect rather than addressing it after infiltration occurs.
3Object-generated harmful factors
If the recess opening width is increased to prevent resin infiltration, then resin infiltration is prevented, but the electronic component cannot achieve sufficient size reduction
Solution Approach 1:
Rather than uniformly increasing the opening width, the invention uses asymmetric configuration: the bottom opening width is narrowed (but still wider than the device unit to prevent infiltration), while the top opening width is widened (narrower than device unit width). This asymmetric approach prevents resin infiltration while minimizing the overall volume increase, achieving both goals simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a reduction in the size of electronic components while maintaining effective pixel area and preventing resin infiltration, thus enhancing the semiconductor element's effective area.
Implementation Method 1
a photoelectric conversion element is arranged on the primary face of the substrate
Data Source
AI summary
An electronic component includes a support member in which a recess part having a bottom face and a side face is provided, and a device unit that includes a substrate and is fixed to the support member so that a primary face of the substrate faces the recess part. An opening width of the recess part is, on the side of the bottom of the recess part with respect to the primary face, narrower than the width of the device unit and, on the opposite side of the bottom of the recess part with respect to the primary face, wider than the width of the device unit. An end face of the substrate overlaps with the side face of the recess part in a direction perpendicular to the primary face of the substrate. A photoelectric conversion element is arranged on the primary face of the substrate.