Stack Sensor Package Frame for Wire Bonding Stability
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Solution Overview
Problem
Conventional sensor package structures face stability issues and defects during wire bonding, particularly when larger semiconductor chips are combined with smaller sensor chips, leading to potential damage and inadequate heat dissipation.
Innovation Solution
A stack type sensor package structure is designed with a substrate, semiconductor chip, frame, sensor chip, wires, transparent layer, and package compound, where the frame provides structural support and separates the chips, allowing for stable wire bonding and enhanced heat dissipation through the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a sensor chip is adhered on a semiconductor chip in a conventional sensor package structure, then the package structure can be compact, but the wire bonding process may damage the sensor chip due to the size difference between chips
Solution Approach 1:
A frame structure is introduced as an intermediary component between the semiconductor chip and the sensor chip. The frame provides a bearing plane that supports the sensor chip, separating it from the semiconductor chip and providing stable support during wire bonding operations, thereby preventing damage to the sensor chip while maintaining compact packaging
2Device complexity
If the sensor chip is directly adhered on the semiconductor chip, then the package structure is simplified, but the structural strength and stability are insufficient
Solution Approach 1:
The package structure is segmented into distinct functional components: a substrate, a frame structure, a semiconductor chip, and a sensor chip. The frame is divided into a side wall portion and a bearing plane portion, creating modular segments that provide structural strength while maintaining overall simplicity of the package design
3Ease of manufacture
If the sensor chip is directly adhered on the semiconductor chip, then the manufacturing process is simplified, but heat dissipation from the semiconductor chip adversely affects the sensor chip
Solution Approach 1:
The frame structure serves as a thermal intermediary that separates the sensor chip from the semiconductor chip. This intermediary structure prevents direct thermal coupling, allowing heat from the semiconductor chip to be dissipated through the substrate without adversely affecting the sensor chip, while still enabling a relatively simple manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the structural strength and stability of the sensor package, prevents damage during wire bonding, and improves heat dissipation by isolating the sensor chip from the semiconductor chip's heat, ensuring effective connectivity and performance.
Implementation Method 1
Heat from the semiconductor chip can be dissipated by conduction through the substrate, thus heat dissipating performance of the stack type sensor package structure is effectively enhanced
Data Source
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AI summary
A stack type sensor package structure includes a substrate (1), a semiconductor chip (2) disposed on the substrate (1), a frame (3) disposed on the substrate (1) and aside the semiconductor chip (2), a sensor chip (4) disposed on the frame (3), a plurality of wires (5) electrically connecting the sensor chip (4) and the substrate (1), a transparent layer (6) being of its position corresponding to the sensor chip (4), a support (7) maintaining the relative position between the sensor chip (4) and the transparent layer (6), and a package compound (8) disposed on the substrate (1) and partially covering the frame (3), the support (7), and the transparent layer (6). Thus, through disposing a frame (3) within the stack type sensor package structure (100), the structural strength of the overall sensor package structure (100) is reinforced, and the stability of the wiring of the sensor chip (4) is effectively increased.