Mold Seal Protrusions for Imaging Sensor Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In imaging apparatuses, the thermal expansion difference between the interposer and mold resin leads to a bent adhesive surface, causing void defects and inadequate adhesion of the glass, which affects image quality and particle interference.
Innovation Solution
A mold with protrusions on its seal surface is used to support the glass, ensuring a stable adhesive layer by maintaining a sufficient amount of adhesive between the glass and the mold, preventing void defects and improving adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the mold resin is thermally cured at high temperature and then cooled to room temperature, then the mold resin can be set and hardened, but the adhesive surface of the mold bends back due to thermal expansion difference between the interposer and the mold, causing void defects and thin adhesive areas
Solution Approach 1:
The patent applies local quality by providing protrusions at specific locations on the adhesive surface of the mold. These protrusions are strategically positioned to provide localized support where the adhesive layer is most needed, rather than attempting to maintain uniform flatness across the entire surface. This resolves the contradiction by accepting that the overall surface may bend but ensuring critical areas have sufficient adhesive thickness through the protrusion structures.
Solution Approach 2:
The patent implements preliminary action by forming the protrusions on the mold adhesive surface before the bonding process. This pre-formed structure anticipates the thermal expansion and bending that will occur during curing, positioning the protrusions to compensate for the expected deformation and ensure adequate adhesive thickness in critical areas throughout the thermal cycle.
2Area of stationary object
If the adhesive layer becomes thin in some areas due to the bent back adhesive surface, then the bonding area is reduced, but void defects are generated in the adhesive layer
Solution Approach 1:
The protrusions create local quality variations in the adhesive layer, ensuring that critical bonding areas maintain sufficient adhesive thickness even when other areas become thin. This localized reinforcement prevents void defects in key bonding regions while preserving overall bonding area.
Solution Approach 2:
The protrusions act as beforehand cushioning by pre-positioning adhesive reservoirs in areas prone to thinning during thermal cycling. These protrusions compensate for expected adhesive loss during the bonding process, ensuring minimum adhesive thickness is maintained to prevent void defects and maintain bonding reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protrusions on the mold seal surface prevent void defects in the adhesive layer, ensuring proper fixation of the glass and reducing changes in incident rays and particle interference, thereby enhancing image sensor performance.
Implementation Method 1
Due to a difference in thermal expansion between the interposer and the mold at this time, an adhesive surface of the mold can be bent back.
Data Source
AI summary
An imaging apparatus includes: an interposer on which an image sensor including a light reception section is disposed; a translucent member that is provided on the light reception section; and a mold that is formed in sides of the interposer having a rectangular shape and bonded to the translucent member to support the translucent member, the mold including a seal surface that is bonded to the translucent member, the seal surface being provided with a protrusion.