Bent Array Substrate and Nested Support Plate for Foldable Display Strength
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Solution Overview
Problem
The increasing intelligence and integration in electronic devices lead to higher power consumption, necessitating larger battery capacities to enhance device endurance, but this often compromises the thickness and screen strength of foldable devices.
Innovation Solution
The electronic device incorporates a display screen with a bent array substrate, a first support plate that defines an accommodating cavity, and a flexible circuit board with varying wiring layers, allowing for reduced volume and increased contact area between the support plate and the screen, thereby enhancing screen strength and battery capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If the battery capacity is increased to enhance device endurance, then the power consumption is improved, but the device thickness increases and screen strength decreases
Solution Approach 1:
The array substrate is bent along a bending line to form a three-dimensional structure, transforming the flat two-dimensional layout into a three-dimensional configuration. This allows the support plate to wrap around and support the bent substrate from multiple directions, increasing the contact area and structural support without increasing device thickness.
Solution Approach 2:
The bent array substrate is partially received and nested within the accommodating cavity formed by the support plate. This nesting arrangement allows the substrate to be embedded within the device structure, maximizing space utilization and providing structural support while maintaining a compact form factor.
2Duration of action of moving object
If the battery capacity is increased to enhance device endurance, then the power consumption is improved, but the device thickness increases
Solution Approach 1:
The array substrate is bent along a bending line to form a three-dimensional structure, transforming the flat two-dimensional layout into a three-dimensional configuration. This allows the support plate to wrap around and support the bent substrate from multiple directions, increasing the contact area and structural support without increasing device thickness.
Solution Approach 2:
The bent array substrate is partially received and nested within the accommodating cavity formed by the support plate. This nesting arrangement allows the substrate to be embedded within the device structure, maximizing space utilization and providing structural support while maintaining a compact form factor.
3Strength
If the contact area between support plate and display screen is increased to enhance screen strength, then the structural integrity is improved, but the volume of accommodating cavity increases
Solution Approach 1:
The array substrate is bent along a bending line to form a three-dimensional structure, transforming the flat two-dimensional layout into a three-dimensional configuration. This allows the support plate to wrap around and support the bent substrate from multiple directions, increasing the contact area and structural support without increasing device thickness.
Solution Approach 2:
The support plate features a localized accommodating cavity that is strategically positioned to receive the bent portion of the array substrate. This localized design provides enhanced support where needed while minimizing the overall volume occupied by the support structure.
Data Source
AI summary
An electronic device includes a display screen, a first support plate and a flexible circuit board. The display screen includes an array substrate, the array substrate includes a substrate body and a bent part connected with a first side surface of the substrate body, and the bent part is bent towards a non-display side of the display screen. The first support plate is connected with the substrate body and cooperates with a part of the substrate body to define a first accommodating cavity, and the bent part is partially located in the first accommodating cavity. The flexible circuit board is arranged in the first accommodating cavity, connected with and in conduction with the bent part, and includes a plurality of layered regions, and the number of wiring layers in each layered region is different from the numbers of wiring layers in other layered regions.