Flexible Printed Circuits TRIZ Cases

Nesting a bent array substrate within a support plate cavity expands the contact area, resolving the trade-off between screen strength and device thickness.

A display panel bonding layer uses segmented conductive particle zones to maintain electrical connectivity between adjacent pads.

Inclined substrate auxiliary electrodes expand contact area to resolve weak bonding forces on perpendicular display device side surfaces.

A Z-fold display panel uses a nested outer body to protect integrated components while maintaining a thin profile.

Adjustable bonding positions on a ring-shaped flexible substrate adapt to multiple ring sizes.

Differentiating gold finger widths based on signal type resolves impedance matching issues while maintaining compact board dimensions.

Folding support members stabilize a rollable display during extension, while an FPCB routes signals through the mechanism to maintain connectivity.

Cross-linked polyimide resin enables thin flexible circuit boards with improved toughness and film workability.

Direct terminal bonding via ultrasonic vibration minimizes wiring length and transmission loss in multilayer thermoplastic resin substrates.