Resin Composition for Flexible Circuit Boards
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Solution Overview
Problem
Existing flexible circuit boards face challenges with thickness, flexibility, toughness, and thermal stability, particularly due to the rigidity of aryl polyimide and inadequate adhesion properties, which hinder their application in modern, thinner, and more functional electronic devices.
Innovation Solution
A resin composition comprising a cross-linked polymer formed by a diamine unit with an imide group and an isocyanate unit, offering excellent toughness, flexibility, film workability, and thermal stability, suitable for use as an insulating matrix or adhesion layer in circuit boards, achieved through specific molar ratios and synthesis conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aryl polyimide is used as the insulating matrix, then thermal stability and mechanical properties are improved, but flexibility and workability deteriorate
Solution Approach 1:
The patent modifies the chemical structure of polyimide by introducing aliphatic groups (such as methyl, ethyl, or propyl groups) at the imide ring positions, changing the material's physical parameters to reduce crystallinity and improve flexibility while maintaining thermal stability through controlled cross-linking density
Solution Approach 2:
The patent creates a composite structure by combining polyimide base polymer with cross-linking agents (such as isocyanate or epoxy compounds) to form a cross-linked network that integrates the thermal stability of polyimide with the flexibility of the cross-linked structure
2Length of stationary object
If thin polyimide layer is used to reduce circuit board thickness, then product thickness is reduced, but yield and quality deteriorate
Solution Approach 1:
The patent changes the physical parameters of the polyimide by reducing crystallinity through aliphatic group introduction and controlling cross-linking, which allows the material to maintain structural integrity and adhesion at thinner thicknesses without compromising quality
Solution Approach 2:
The patent applies local modification by introducing cross-linking at specific locations within the polyimide structure to enhance local mechanical properties and adhesion in thin regions, allowing thinner overall design while maintaining required performance
3Strength
If epoxy adhesive is used as the protection layer adhesive, then adhesion is improved, but flexibility and thickness control deteriorate
Solution Approach 1:
The patent modifies the adhesive composition by incorporating cross-linking agents that create a cross-linked network structure, changing the physical parameters to achieve both strong adhesion and maintained flexibility, allowing thinner layer application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition enables the production of flexible thin circuit boards with enhanced properties, allowing for thinner designs and improved reliability, while maintaining excellent adhesion and thermal stability, suitable for various electronic devices.
Implementation Method 1
a cross-linked polymer formed by a diamine unit containing an imide group and an isocyanate unit
Data Source
AI summary
A resin composition, an insulating matrix comprising the same and a circuit board using the same. The resin composition of the present invention comprises: a cross-linked polymer formed by a diamine unit containing an imide group, which is represented by the following formula (1), and an isocyanate unit represented by the following formula (2):wherein, R1, R2, A, X and a are defined in the specification.