Inclined Substrate Auxiliary Electrodes for FPC Bonding
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Solution Overview
Problem
Existing display devices face challenges in minimizing the bezel area by achieving stable bonding of flexible printed circuit boards to the side surfaces of substrates, as the perpendicular orientation of these surfaces results in weak bonding forces and reduced contact areas for power and signal application.
Innovation Solution
The display device incorporates substrates with inclined side surfaces, featuring auxiliary electrodes with bent portions that increase the contact area and bonding force between the substrates and the flexible printed circuit board, thereby enhancing the stability of power and signal application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the flexible printed circuit board is bonded to the perpendicular side surface of the substrate, then the bonding area is minimized, but the bonding force is weak and the contact area for power and signal application is reduced
Solution Approach 1:
The substrate side surface is changed from a perpendicular (flat) orientation to an inclined orientation relative to the upper and lower substrates. This angular/curved geometric modification increases the contact area between the flexible printed circuit board and the substrate, thereby enhancing the bonding force while still minimizing the overall bezel area.
Solution Approach 2:
The bonding interface is transitioned from a two-dimensional perpendicular connection to a three-dimensional inclined surface connection. By introducing the inclination angle, the bonding area is expanded in the vertical dimension, allowing for increased contact area without increasing the horizontal footprint, thus maintaining minimal bezel area while improving bonding strength.
2Device complexity
If the flexible printed circuit board is bonded to the perpendicular side surface of the substrate, then the structure is simple, but the contact area for power and signal application is reduced
Solution Approach 1:
The substrate side surface is changed from a perpendicular (flat) orientation to an inclined orientation relative to the upper and lower substrates. This angular/curved geometric modification increases the contact area between the flexible printed circuit board and the substrate, thereby enhancing the bonding force while still minimizing the overall bezel area.
3Ease of manufacture
If the auxiliary electrode is disposed on the perpendicular side surface, then the manufacturing process is simple, but the bonding force and electrical connection stability are weak
Solution Approach 1:
The substrate side surface is changed from a perpendicular (flat) orientation to an inclined orientation relative to the upper and lower substrates. This angular/curved geometric modification increases the contact area between the flexible printed circuit board and the substrate, thereby enhancing the bonding force while still minimizing the overall bezel area.
Solution Approach 2:
The bonding interface is transitioned from a two-dimensional perpendicular connection to a three-dimensional inclined surface connection. By introducing the inclination angle, the bonding area is expanded in the vertical dimension, allowing for increased contact area without increasing the horizontal footprint, thus maintaining minimal bezel area while improving bonding strength.
Data Source
AI summary
A display device includes a lower substrate that includes a side surface having a first inclined surface. An upper substrate is disposed on the lower substrate and includes a side surface having a second inclined surface. A first electrode is disposed on a surface of at least one of the lower substrate or the upper substrate. An auxiliary electrode is disposed on the first inclined surface of the lower substrate and the second inclined surface of the upper substrate. The auxiliary electrode includes a first portion corresponding to the first inclined surface, a second portion corresponding to the second inclined surface, and a bent portion bent at a predetermined angle with respect to the first and second inclined surfaces. The first electrode may be in contact with the bent portion on the first exposed surface to electrically connect to the auxiliary electrode.