Component-Embedded Substrate Wiring Length Reduction
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Solution Overview
Problem
Existing multilayer substrates with embedded electronic components experience significant transmission loss due to lengthy planar conductors and interlayer connection conductors, which increase the risk of short circuits and reduce the precision of terminal placement.
Innovation Solution
A component-embedded substrate with a multilayer body of thermoplastic resin bases, where the first component's terminal is ultrasonically bonded to a planar conductor, and the second component's terminal is directly connected to an interlayer connection conductor, reducing the wiring length and allowing for closer terminal spacing, thereby minimizing transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If planar conductors and interlayer connection conductors are extended to connect electronic components embedded in different bases, then the components can be connected across multiple layers, but the wiring length increases causing transmission loss
Solution Approach 1:
The patent utilizes the stacking direction (third dimension) to reduce wiring length by connecting terminals facing each other across bases. Electronic components are arranged with terminals oriented toward each other, and interlayer connection conductors extend in the stacking direction to directly connect these facing terminals, minimizing the conductor path length compared to planar routing.
Solution Approach 2:
The patent applies different connection strategies to different terminals based on their orientation and position. Terminals facing each other across bases are connected via interlayer connection conductors in the stacking direction, while other terminals use planar conductors on the same base, optimizing the connection path for each terminal pair.
2Loss of energy
If wiring length is reduced by direct connection, then transmission loss decreases, but the complexity of precise terminal placement increases
Solution Approach 1:
The patent performs preliminary arrangement of electronic components during the embedding process, positioning components with terminals facing each other in the stacking direction. This preliminary positioning enables subsequent direct connection via interlayer connection conductors, reducing the need for complex post-assembly adjustments and minimizing wiring length.
3Length of stationary object
If electronic components are embedded in multiple bases with terminals facing each other, then wiring length is reduced, but the device structure becomes more complex
Solution Approach 1:
The patent merges the embedding process of electronic components with the formation of interlayer connection conductors. Through-holes are formed and filled with conductive material during the same manufacturing sequence, integrating multiple functions into a unified process and reducing overall structural complexity despite the multi-base configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution decreases the length of the wiring portion, reduces transmission loss, and allows for more precise terminal placement, enhancing the reliability and efficiency of high-frequency signal transmission.
Implementation Method 1
a first planar conductor bonded directly to the first terminal by ultrasonic bonding
Data Source
AI summary
A component-embedded substrate includes first to sixth thermoplastic resin bases, a first electronic component in the second thermoplastic resin base and including a first terminal, and a second electronic component in the fifth thermoplastic resin base and including a second terminal. The first terminal faces the second electronic component in a stacking direction. The second terminal faces the first electronic component in the stacking direction. A first planar conductor to which the first terminal is directly bonded is provided on the third thermoplastic resin base. An interlayer connection conductor to which the second terminal is directly bonded and in communication with the first planar conductor is provided in or on the fourth thermoplastic resin base.