Bent Insulated Metal Substrate PCB for Automotive LED Thermal Management

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Solution Overview

Problem

Existing heat dissipation methods for automotive light sources, particularly LEDs, are inefficient and limit the versatility of lighting elements due to the difficulty in transferring heat without compromising the structural integrity or manufacturing complexity.

Innovation Solution

An insulated metal substrate printed circuit board with strategically designed bending portions acts as a heatsink, enhancing heat transfer and dissipation through convection, while maintaining mechanical integrity and simplifying manufacturing by integrating heat dissipation into the board's design, eliminating the need for additional heatsinks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a separate heatsink is used with fins for heat dissipation, then heat dissipation efficiency is improved, but device complexity and manufacturing complexity increase

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the heatsink function with the printed circuit board by creating a bent IMS PCB structure. The board itself forms heat-dissipating surfaces through bending, eliminating the need for a separate heatsink component. This merging of functions reduces device complexity while maintaining effective heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The printed circuit board serves multiple functions: electrical connectivity, structural support, and heat dissipation. By designing the IMS PCB with bending portions that create extended surfaces, the board becomes a multi-functional component that performs both circuitry and thermal management roles simultaneously.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If a separate heatsink is used for heat dissipation, then heat dissipation efficiency is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The heatsink functionality is merged into the PCB manufacturing process itself. The bending portions are created during PCB fabrication, allowing the heat dissipation structure to be produced in the same manufacturing cycle as the circuit board, thereby simplifying overall manufacturing.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat dissipation structure is prepared in advance during PCB fabrication. The bending portions and extended surfaces are created as part of the board manufacturing process before assembly, eliminating the need for separate heatsink installation steps.

Inventive Principle:

Principle #10Preliminary action

3Temperature

If the printed circuit board is bent to create heat dissipation surfaces, then heat transfer efficiency is improved, but mechanical integrity may be compromised

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidmechanical integrity

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The patent uses an Insulated Metal Substrate (IMS) PCB, which is a composite structure consisting of a metal core (typically aluminum) sandwiched between two dielectric layers. The metal core provides both structural strength to withstand bending and excellent thermal conductivity for heat dissipation, while the dielectric layers provide electrical insulation.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The bending portions are strategically designed in specific locations where they create effective heat dissipation surfaces without compromising the overall structural integrity of the PCB. The rigid IMS construction allows localized bending while maintaining global mechanical strength.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution improves thermal behavior by optimizing heat paths and dissipation, reduces manufacturing complexity, and increases the versatility of automotive luminous devices by integrating heat dissipation into the printed circuit board's design, ensuring effective heat management without additional components.

Implementation Method 1

the two portions make the printed circuit board a non-plane element, thus making heat transferring easier between the printed circuit board itself and the surrounding fluid

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

heat is transferred from the PCB to the heatsink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11432401B2Electronic assembly and automotive luminous device

Publication Date: 2022.08.30 VALEO VISION SA

AI summary

The invention is related to an electronic assembly comprising a printed circuit board and an electronic component. The printed circuit board comprises a first side and a second side opposite to the first side. The electronic component is installed in the first side of the printed circuit board. The printed circuit board is an insulated metal substrate printed circuit board and comprises a bending portion which divides the printed circuit board into a first main portion and a second main portion, the electronic component being located in the first main portion. The first and second main portions are not comprised in a common plane.