Bent Spacer Module With Localized Thickness for COF Chip Protection

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Solution Overview

Problem

The challenge in existing technologies is that as the border where the display module is bound to the Chip On Film (COF) becomes narrower, the bending radius becomes smaller, leading to a thinner bent spacer that is ineffective in protecting the driving chip during strength tests, and the production efficiency is compromised due to the need for additional bounding devices.

Innovation Solution

A display device with a bent spacer that includes a first film layer and a second film layer, where the portion contacting the driving chip has a greater thickness than the remaining portion, providing enhanced protection and adhesion, while maintaining a narrow border, and a bent spacer module with a specially designed release film to facilitate assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the border width is reduced to increase screen-to-body ratio, then the screen proportion is improved, but the bent spacer thickness becomes too thin to protect the driving chip

Engineering Contradiction:
Improvescreen-to-body ratioVSAvoiddriving chip protection
Core Design Contradiction:
Area of stationary objectVSStrength

Solution Approach 1:

The bent spacer is designed with non-uniform thickness, featuring a first thickness in the driving chip protection area and a second thickness in other areas. This local quality differentiation allows the spacer to provide enhanced protection where needed while maintaining the narrow border design for high screen-to-body ratio.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Instead of uniformly increasing the spacer thickness across the entire border, the invention introduces thickness variation along the width dimension of the spacer. The first thickness region is specifically positioned under the driving chip area, creating a three-dimensional thickness profile that addresses protection needs without compromising overall device thinness and screen proportion.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Strength

If additional bounding devices are used to protect the driving chip, then the protection capability is improved, but the device complexity and production efficiency deteriorate

Engineering Contradiction:
Improvedriving chip protectionVSAvoidnumber of components
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The invention merges the protection function into the bent spacer itself by creating a first thickness region that directly contacts and protects the driving chip. This eliminates the need for separate bounding devices, reducing component count and simplifying the overall structure while maintaining effective driving chip protection.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The bent spacer is designed to perform multiple functions simultaneously: it provides spacing between the display module and back cover, enables bending of the COF, and protects the driving chip through its first thickness region. This multi-functionality reduces the need for additional dedicated protection components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Strength

If additional bounding devices are used to protect the driving chip, then the protection capability is improved, but the production efficiency deteriorates

Engineering Contradiction:
Improvedriving chip protectionVSAvoidassembly efficiency
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

By integrating the driving chip protection function into the bent spacer structure itself, the invention reduces the number of assembly steps. The bent spacer with its first thickness region can be installed in a single operation, eliminating the need for separate bounding device installation and improving production efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20250287556A1Display device, bent spacer module and assembling method thereof
Publication Date: 2025.09.11 CHENGDU BOE OPTOELECTRONICS TECH CO LTD
  • US20250287556A1 patent drawing
  • US20250287556A1 patent drawing
  • US20250287556A1 patent drawing

AI summary

A display device, a bent spacer module and an assembling method thereof are provided. The display device includes: a protective cover plate; a display module, including a display surface facing the protective cover plate and a back surface away from the protective cover plate; a chip-on-film, at least part of the chip-on-film being located on the back surface and being in binding connection with an edge of the display module; a driving chip, which is located on a side, facing the display module, of the chip-on-film on the back surface, and is in binding connection with the chip-on-film; and a bent spacer, which is located between the driving chip and the back surface, a thickness of a part of the bent spacer contacting the driving chip being greater than that of the remaining part of the bent spacer.