Bernoulli Substrate Chuck for Contactless Wafer Separation
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Solution Overview
Problem
In fluid processing and transport of substrates, such as semiconductor wafers, existing methods often result in contamination and damage due to particulates and improper handling, which is a challenge in maintaining a clean environment for processing and transport.
Innovation Solution
The implementation of a substrate loader and unloader system utilizing a Bernoulli support mechanism, which includes a Bernoulli chuck with a moveable central chuck surface and a peripheral edge seal, allows for non-contact handling and separation of substrates from adhering surfaces using air bearing forces, minimizing contact and adhesion-related issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional contact-based substrate handling methods are used, then mechanical grip and control are achieved, but substrate contamination and damage occur due to particulates and adhesion forces
Solution Approach 1:
The patent replaces traditional mechanical contact-based substrate handling with a Bernoulli-based air bearing system. The Bernoulli surface generates a cushion of air that levitates the substrate, eliminating direct mechanical contact between the handling mechanism and substrate. This substitution of mechanical forces with aerodynamic forces prevents particulate contamination and damage while maintaining reliable substrate control and positioning throughout the fluid processing operation.
Solution Approach 2:
The patent employs pneumatic principles through the Bernoulli mechanism, where compressed air is introduced through the Bernoulli surface to create a pressurized air bearing. This pneumatic cushion supports the substrate weight and enables contactless handling, transport, and processing. The controlled air pressure maintains the substrate in a levitated state, preventing adhesion to handling surfaces and eliminating contamination from direct contact.
2Reliability
If substrates are placed against elastomeric surfaces for sealing, then sealing and processing are achieved, but adhesion and stiction cause handling difficulties and potential damage
Solution Approach 1:
The patent replaces direct mechanical contact with elastomeric surfaces with a Bernoulli air bearing system that maintains sealing through controlled air pressure rather than physical adhesion. The Bernoulli surface creates a stable air cushion that holds the substrate in position without the stiction and adhesion problems associated with elastomeric materials, enabling easy separation and handling after processing while maintaining effective sealing during the process.
Solution Approach 2:
The patent introduces a Bernoulli air bearing as an intermediary between the handling mechanism and the substrate. This air cushion acts as a mediator that provides the necessary sealing and positioning forces during processing, then allows clean separation without the adhesive bonding problems of direct elastomeric contact. The air bearing intermediary eliminates stiction while maintaining processing integrity.
3Measurement precision
If direct contact handling methods are used, then mechanical control and positioning are achieved, but particulate contamination and substrate damage occur
Solution Approach 1:
The patent substitutes mechanical contact-based positioning with Bernoulli-based aerodynamic positioning. The Bernoulli surface generates a controllable air bearing that provides precise substrate positioning and orientation without mechanical contact. This aerodynamic control system maintains measurement precision and positioning accuracy while completely eliminating particulate contamination and damage from direct mechanical handling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces substrate contamination and damage by using air bearing forces to manage adhesion and transport substrates without direct contact, maintaining a clean environment and preventing stiction-related issues during processing and handling.
Implementation Method 1
a Bernoulli chuck surface axially moveable relative to a support with a predetermined motion profile... using air bearing forces
Implementation Method 2
SUBSTRATE LOADER AND UNLOADER HAVING A BERNOULLI SUPPORT
Data Source
AI summary
A substrate chuck includes a frame forming a support adapted to support an adhering surface thereon, and a Bernoulli chuck surface coupled to the frame and adapted to support the substrate. The Bernoulli chuck surface is axially moveable relative to the support between first and second positions. In the first position, the substrate is coupled to the adhering surface, and the substrate is separated from the adhering surface with movement of the Bernoulli chuck from the first position to the second position, without contact between the substrate and the Bernoulli chuck surface.