Fault Isolation in BGA Packages via Layer Segmentation
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Solution Overview
Problem
Current fault analysis methods, such as hotspot analysis, struggle to accurately determine the location of short circuits or electric leakage in complex device packaging due to two-dimensional analysis limitations, particularly in stacked chip models where overlapping components obscure fault detection.
Innovation Solution
A fault isolation analysis method that involves detecting electrical faults in interconnecting wires, isolating components, and using X-ray imaging and grinding techniques to determine if faults lie within the substrate, chip, or wires, allowing for precise identification of fault causes in BGA package devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional two-dimensional hotspot analysis is used, then the analysis process is simple, but the fault detection precision deteriorates in complex stacked chip packages
Solution Approach 1:
The patent segments the complex package structure into distinct layers (substrate, interconnecting wires, chip structure) and systematically isolates each layer for fault detection. This segmentation allows the analysis to proceed layer-by-layer, preventing the complexity of the overall structure from overwhelming the detection process while maintaining high precision through focused examination of each segment.
Solution Approach 2:
The patent transitions from traditional two-dimensional hotspot analysis to a three-dimensional layered analysis approach. By considering the vertical stacking dimension and using cross-sectional views to isolate different layers, the method achieves superior fault detection precision in complex three-dimensional package structures while managing the increased complexity through systematic dimensional decomposition.
2Measurement precision
If the package structure is broken down for isolation, then the fault location precision is improved, but the device complexity and processing difficulty increase
Solution Approach 1:
The patent employs segmentation by breaking down the package structure into isolatable layers only when necessary for fault detection. The method first attempts non-invasive electrical testing, and only proceeds to physical segmentation (breaking) when faults are localized to specific layers. This selective segmentation maintains processing ease while achieving high fault location precision when required.
Solution Approach 2:
The patent performs preliminary electrical fault detection and localization before physical breakdown. By using electrical testing methods first to identify which specific layer contains the fault, the method prevents unnecessary breaking of the package structure. This preliminary action reduces processing difficulty by ensuring that breakdown operations are performed only when and where absolutely necessary.
3Measurement precision
If electrical isolation is performed by breaking wires, then the fault isolation precision is improved, but the time required for analysis increases
Solution Approach 1:
The patent performs preliminary electrical testing and fault localization before physical wire breaking. This preliminary action identifies the specific layer containing the fault, ensuring that wire breaking operations are performed only when necessary and only on the specific wires leading to the faulty layer. This approach minimizes the time required for analysis by avoiding unnecessary isolation steps while maintaining high fault isolation precision.
Solution Approach 2:
The patent uses segmentation to isolate only the specific wires and layers containing faults, rather than performing comprehensive breakdown of the entire package structure. This targeted segmentation reduces analysis time by focusing efforts only on the relevant portions of the device while maintaining high precision in fault isolation.
Data Source
AI summary
A fault isolation analysis method includes: providing a package structure in which there is an electrical fault; detecting whether the electrical fault is in interconnecting wires, and if the electrical fault is in the interconnecting wires, determining that the electrical fault is caused by the interconnecting wire; and if the electrical fault is not in the interconnecting wires, breaking the interconnecting wires to electrically isolate the chip structure from the substrate, then detecting whether the electrical fault is in the structure, and if the electrical fault is able to be detected, determining that the electrical fault is caused by the substrate, or if the electrical fault is not able to be detected, determining that the electrical fault is caused by the chip structure.