Parallel Conductive Trace Rings for BGA Inductance Reduction
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Solution Overview
Problem
Integrated circuit (IC) packages with two-layer ball grid array (BGA) substrates face challenges with high inductance and poor error vector magnitude (EVM) performance, especially in wireless applications over a wide range of frequencies, due to long bond wires and non-uniform impedance, making multi-layer designs costly and impractical.
Innovation Solution
A reduced inductance power distribution pattern is implemented using a two-layer BGA substrate with conductive trace rings routed in parallel and shorter bond wires to couple the die to conductive balls, reducing inductance and improving EVM performance while controlling costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If long bond wires are used to couple power from conductive balls to the die in a two-layer BGA substrate, then the manufacturing cost is reduced, but the inductance increases and EVM performance deteriorates
Solution Approach 1:
The patent introduces conductive trace rings routed in parallel between the conductive balls and the die, adding a dimensional aspect to the power distribution path. This parallel routing configuration reduces the effective inductance by providing multiple current paths, thereby improving EVM performance while maintaining the two-layer substrate structure and avoiding increased manufacturing complexity
Solution Approach 2:
The patent modifies the power distribution network parameters by introducing parallel conductive trace rings, which changes the inductance characteristic of the bond wire connection. This parameter change reduces the total inductance value without requiring shorter bond wires or additional substrate layers, thus maintaining cost-effectiveness while improving RF performance
2Reliability
If multi-layer BGA substrates are used to reduce bond wire length and inductance, then EVM performance improves, but manufacturing cost increases
Solution Approach 1:
The patent segments the power distribution function by introducing separate conductive trace rings for different current paths between the conductive balls and the die. This segmentation creates multiple parallel routes for current flow, effectively reducing inductance without requiring a multi-layer substrate structure, thus achieving performance improvement at the lower two-layer manufacturing cost
Solution Approach 2:
The patent creates multiple copies of conductive trace rings in parallel between the same conductive balls and die connections. These parallel copies provide alternative current paths that reduce the effective inductance, achieving the same effect as multi-layer designs but implemented within the simpler two-layer architecture
3Ease of manufacture
If conventional power distribution patterns are used in two-layer BGA substrates, then manufacturing cost is controlled, but inductance remains high across all frequencies
Solution Approach 1:
The patent adds a routing dimension by introducing conductive trace rings that travel between the conductive balls and die in parallel configurations. This dimensional approach to power distribution creates multiple spatial paths for current flow, reducing inductance across the frequency spectrum while maintaining the cost-effective two-layer substrate design
Data Source
AI summary
A reduced inductance power distribution pattern for an integrated circuit (IC) package is disclosed. The IC package can include a die in which the electronic circuitry is formed, a ball grid array (BGA) substrate, and a plurality of conductive balls coupled to the BGA substrate. The IC package can further include a plurality of conductive trace rings routed in parallel, and a plurality of bond wires for coupling the die to the conductive balls via the conductive trace rings.