BGA Socket Dual Pinch Contact Slider Actuation
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Solution Overview
Problem
The existing BGA socket devices experience a decrease in contact force with solder balls due to repeated elastic deformation of movable terminals, leading to reduced durability and reliability in IC testing, as the elastic restoring force diminishes over time.
Innovation Solution
A BGA socket device with dual pinch-type contacts, where the upper ends of the fixed and movable terminals are offset by a predetermined distance, and a slider mechanism that generates an operating force through horizontal sliding, independent of the elastic force of the contact, to maintain consistent contact and extend the device's lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a movable terminal is used in a pinch-type contact to open and close the contact with a solder ball, then the contact can be opened and closed repeatedly for IC testing, but the elastic restoring force of the movable terminal decreases due to repeated elastic deformation, leading to reduced contact force and durability
Solution Approach 1:
The contact structure is divided into a fixed terminal and a movable terminal. The fixed terminal remains stationary while the movable terminal is actuated by the slider mechanism. This segmentation allows the movable terminal to perform the opening/closing function without requiring elastic restoration, as the slider provides the actuating force directly.
Solution Approach 2:
A slider mechanism is introduced as an intermediary component between the cover and the movable terminal. The slider converts the vertical movement of the cover into horizontal movement that opens and closes the movable terminal. This intermediary mechanism eliminates the need for the movable terminal to rely on its own elastic restoring force.
2Device complexity
If the movable terminal relies on its own elastic restoring force to return to the initial position, then the structure can be simple, but the durability decreases after approximately 20,000 cover cycles due to stress accumulation
Solution Approach 1:
The contact mechanism transitions from a static elastic restoration system to a dynamic slider-based actuation system. The slider is moved horizontally by the cover's vertical movement, dynamically opening and closing the movable terminal without relying on elastic deformation recovery. This dynamic mechanism significantly extends the device lifespan beyond 20,000 cycles.
3Reliability
If the upper ends of the fixed terminal and movable terminal are offset by a predetermined distance, then the dual pinch-type contact can engage the solder ball more effectively, but the structure becomes more complex
Solution Approach 1:
The fixed terminal and movable terminal are positioned asymmetrically with their upper ends offset by a predetermined distance. This asymmetric arrangement creates a dual pinch-type contact that effectively engages the solder ball from different positions, improving reliability while the offset distance is optimized to balance engagement effectiveness with structural simplicity.
Data Source
AI summary
Disclosed is a BGA socket device used for testing a BGA IC and having a dual pinch type contact. The BGA socket device includes: contacts each including a fixed terminal and a movable terminal and configured such that respective upper ends of the fixed and movable terminals are offset from each other with respect to each solder ball of the IC; a main body in which the contact is provided and fixed; a cover supported on an upper surface of the main body and configured to be movable up and down; and a slider provided between the main body and the cover and configured to slide left and right, thus opening and closing the movable terminal in a horizontal direction, the slider having a fixed terminal receiving hole and a movable terminal receiving hole in which the fixed and movable terminals of the contact are received, respectively, by passing therethrough.