Electronic Circuit Testing TRIZ Cases

Hierarchical selection tree routes internal node signals to output nodes, resolving slow JTAG probing speeds through parallel high-frequency channels.

Through-chip vias route test signals from bottom pads to upper chip nodes, enabling post-packaging voltage verification.

A testing device uses a separate temperature sensor and heater to regulate self-heating electronic components.

A semiconductor structure uses interleaved test electrodes spaced by a predetermined pitch to increase probe card compatibility.

Dual circulation paths separate high and low temperature acclimation zones, eliminating waiting time during mode switching and boosting processing capacity.

Segmented contact probes create hitting marks that reveal pressure distribution variations, distinguishing genuine defects from inspection artifacts.

A semiconductor apparatus connects normal or test lines to memory via a path setting unit, enabling direct defect diagnosis without increasing package size.

Cuts through an insulating substrate allow metal contacts to flex vertically, resolving planarity and contact resistance issues in fine-pitch testing.

An integrated circuit determines external impedance by monitoring output current oscillations with a built-in measurement circuit.

A distributed JTAG test bus controller architecture segments control signals across multiple circuit boards to enable parallel programming operations.

A test device protects buck circuits using a control unit that compares input RF signals against reference values.

Noise modeling system determines transmission loss in air data probes to identify faulty sensors, preventing erroneous altitude measurements from blockages.

A built-in self test circuit captures digital current measurements from an analog block to enable rapid internal node verification.

A test apparatus uses a probe pin with identical tip portions to alternate contact positions after wear.

Scribe line routing lines interconnect test circuits to enable simultaneous wafer testing from a single site, reducing time while preserving circuit integrity.

A circuit breaker monitoring device estimates movable contact consumption using operating time and travel speed measurements.

An insulation transformer with an intermediate tap measures primary side current changes to detect signal status in measurement and control circuits.

A mechanical arm automates semiconductor device handling using dedicated adapting parts for socket manipulation and component gripping.

Electrical measurement replaces manual mechanical adjustment to reduce calibration time and prevent device damage from abnormal needle pressure.

A test apparatus uses independent hold signals to resume master and slave period signal generation without phase initialization.

An adaptive quadrilateral distance module adjusts resistance and reactance elements to detect faults in electrical power systems.

Master programmable IC transmits configuration data to slave dies through interposer routing circuitry for simultaneous programming.

This high-frequency fault component distance protection system eliminates frequency offset and weak feed issues by extracting signals via wavelet transform.

Configurable probe circuits reproduce motherboard environments to detect defects in packaged devices before deployment.

A dice testing method predicts untested item performance using statistical analysis of test data.

A software-only global clock uses timestamps and error boundaries to synchronize storage replication nodes.

A method for electrically testing in-cell touch screens by applying predetermined voltages to driving and detecting lines.

Direct Memory Load Execute Dump test module loads and executes cases at operating clock rates.

Mounting the heating device on a lifting stage eliminates slip rings and wire breakage while maintaining testing throughput.

Probe card circuit replication mimics mounting configurations to detect semiconductor errors before separation, preventing post-mounting waste.

Integrated circuit architecture applies parallel test patterns to multiple cores using shared comparator circuitry.

Time-skewed XOR logic gates isolate identical core faults in SoCs, preventing X-state masking during test.

Test socket uses elastic contact pins to deform longitudinally, preventing interference during narrow pitch insertion and compensating for flatness tolerances.

A folded waveguide connects a grating coupler to an optical circuit chip, routing inspection light through the dicing line region to reduce space requirements.

Scramblers translate logical test addresses to physical driving signals, enabling parallel testing of multiple memory arrays with different configurations.

A semiconductor probe card isolates signal traces from power contacts to maintain linear routing paths.

Boundary scan cells with internal test logic perform built-in self-test to characterize integrated circuit signals, eliminating the need for external equipment.

Measuring frequency response of energy reserve capacitors during operation to verify component validity.

A vision alignment system uses guiding rings and actuators to position integrated circuit contact arrays for precise testing.

A parallel test system defines channel-independent groups to execute total-independence tests simultaneously.

A multilayer wiring substrate embeds a metal core member to form short power supply paths.

Automated testing retrieves boundary-scan properties to operate cells as drivers and sensors, eliminating physical probe access for miniaturized components.

A cryogenic wafer test system uses a translational and rotational actuator to align superconducting die contacts with probe needles.

Horizontal slider actuation maintains consistent contact force on solder balls, preventing degradation from elastic deformation during repeated testing cycles.

A thermal head system segments adapters into independent zones using dedicated heaters and cold plates for precise temperature management.

A system on chip test method isolates individual blocks by disabling components to enable targeted verification.

A calibration unit adjusts pilot tone frequency and level for audio systems.

A dedicated upper terminal group measures current flow to identify cracks in second type semiconductor chips, reducing testing time and costs.